6inch-12inch SiC Substrate Laser Separation System Machine Wafers Customized

6inch-12inch SiC Substrate Laser Separation System Machine Wafers Customized

The Laser Lift-Off (LLO) System is an advanced precision processing technology that utilizes high-energy pulsed lasers to achieve selective material separation at interfaces. This technology is widely applied in semiconductor manufacturing, flexible electronics, optoelectronic devices, and energy sectors. Its core advantages include ​​non-contact processing​​, ​​high-resolution control​​, and ​​multi-material compatibility​​, making it indispensable for applications such as MicroLED mass transfer, flexible display fabrication, and semiconductor wafer-level packaging.

​​Company Service Highlights​​:

​​Customized Solutions​​: Tailored laser wavelength (193nm–1064nm), power (1W–100W), and automation integration to support R&D and mass production.

​​Process Development​​: Laser parameter optimization, beam shaping design, and validation services (e.g., UV laser LLO for sapphire substrates).

​​Smart Maintenance​​: Integrated remote monitoring and fault diagnosis, ensuring 24/7 operational support with <2-hour response time.

Laser separation system machine of technical parameters​

Laser separation system machine of working principle

LLO operates through ​​selective ablation​​ at material interfaces:

​​Laser Irradiation​​: High-energy pulses (e.g., excimer or femtosecond lasers) focus on the target interface (e.g., sapphire-GaN), inducing photothermal/photochemical reactions.

​​Interface Decomposition​​: Laser energy triggers gasification (e.g., GaN → Ga + N₂), generating plasma and thermal stress for controlled delamination.

​​Material Collection​​: Delaminated microstructures are captured via vacuum suction or fluid dynamics, ensuring contamination-free transfer.

​​Key Technologies​​:

• ​​Ultrafast Lasers​​: Femtosecond pulses (<100fs) minimize thermal damage (e.g., MicroLED separation).
• ​​Beam Shaping​​: Linear/rectangular beam profiles enhance efficiency (e.g., flexible PCB batch processing).