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60mm Sapphire Wafer 3mm Thickness Optical Infrared Window

Sapphire Wafer Product Introduction

Sapphire Wafer Precision Cutting Diameter 60mm Thickness 3mm Optical Infrared Window

Sapphire wafer is a precision optical component fabricated from high-purity aluminum oxide (Al₂O₃) single-crystal material, with specifications of 60mm in diameter and 3mm in thickness. It achieves high-precision dimensional control through directional cutting techniques (e.g., laser cutting or diamond wire sawing), with surface roughness controlled to <0.5μm. The crystal orientation options include C-plane (<0001>), A-plane (0001), and M-plane (10-10), catering to diverse application requirements. Inheriting the inherent advantages of sapphire, sapphire wafer ardness (Mohs hardness of 9), high-temperature resistance (melting point of 2045°C), low thermal expansion coefficient (5.3×10⁻⁷/°C), and broad-spectrum transparency (0.15–5.5μm), making it a core material for advanced optoelectronics, semiconductors, and precision instrumentation.

Sapphire Wafer Technical Parameter

Parameter	This Product (60mm×3mm)
Thermal Conductivity	42 W/m·K
Bending Strength	350 MPa
Transmittance (400nm)	>85%
Temperature Range	-200–1600°C
Cost per Piece (CNY)	800–1200
(Data based on C-plane cutting and double-sided polishing. Customizable parameters available.)

Sapphire Wafer Key Features & Advantages

1. Extreme Environmental Adaptability

Sapphire wafer maintains stability under high temperatures (>300°C), strong acids/alkalis, and high-vacuum environments. Suitable for aerospace sensors, laser windows, and other harsh scenarios. Exhibits outstanding thermal shock resistance (withstand temperature differentials >1000°C) without cracking.

2. Superior Optical Performance

High Transmittance: Sapphire wafer with >85% in visible light (400–700nm) and >70% in ultraviolet (200–400nm), outperforming standard glass and quartz.
Low Absorption: Sapphire wafer with <0.1% absorption in near-infrared (1–5μm), ideal for infrared imaging and quantum communication systems.

3. Mechanical & Chemical Stability

Scratch Resistance: Mohs hardness of 9, 10× more wear-resistant than quartz, ensuring long-term surface integrity.
Corrosion Resistance: Withstands all acids/alkalis except hydrofluoric acid, suitable for marine equipment and chemical detection instruments.

4. Precision Fabrication

Achieves ±0.02mm thickness tolerance and ±0.05mm diameter tolerance, ensuring batch consistency. Offers double-sided polishing (Ra <0.1nm) or single-sided polishing for tailored optical designs.

Sapphire Wafer Application Fields

1. Optoelectronic Devices

LED Substrates: Sapphire wafer serves as gallium nitride (GaN) epitaxial growth substrates, enhancing LED efficiency (>120 lm/W) and lifespan (>100,000 hours) for high-end lighting and displays.
Laser Windows: Sapphire wafer used in high-power lasers (e.g., fiber lasers) as input/output mirrors, tolerating >10 MW/cm² intensity with minimized thermal distortion.

2. Semiconductors & Microelectronics

Wafer Dicing: Sapphire wafer acts as cutting blade substrates for semiconductor wafer slicing, reducing edge chipping (<5%) and improving yield.
Infrared Sensors: Fabricates 8–12μm infrared detector windows, Sapphire wafer for security surveillance and industrial temperature measurement.

3. Precision Optical Systems

Camera Lenses: Protects smartphone/camera lenses, tripling impact resistance and reducing weight by 40% at 3mm thickness.
UV Optical Components: Sapphire wafer enables deep-UV lithography optics (248nm wavelength) for advanced semiconductor manufacturing.

4. Defense & Aerospace

Missile Nose Cones: Sapphire wafer withstands >800°C temperatures and impacts, safeguarding guidance system optics in extreme conditions.
Satellite Thermal Control: Sapphire wafer functions as radiation heat sink substrates, regulating spacecraft temperature with ±1°C precision.

5. Emerging Technologies

Flexible Electronics: Ultra-thin sapphire (3mm) enables foldable smartphone displays with >100,000 bending cycles.
Quantum Computing: Sapphire wafer acts as photonic chip packaging substrates, reducing signal loss (<0.5 dB/cm).

Related product recommendations

1. 12inch Sapphire wafer sapphire substrate Al2O3 wafer 9.0Mohs transparent SSP DSP C-axis

2. Sapphire Wafer 4" Dia 100mm±0.1mm Thickness 650um C-plane customized polish

Sapphire Wafer FAQ

1. Q: What are the key advantages of sapphire wafer cutting discs (60mm×3mm)?

A: High-temperature resistance (>1600°C), scratch-proof (Mohs 9 hardness), and broad-spectrum transparency (0.15–5.5μm).

2. Q: What’s your MOQ and lead time for customized orders?

A: MOQ starts at 25pcs, standard lead time 2–4 weeks for bulk production.

Tags: #Sapphire Wafer, #Precision Cutting, #Diameter 60mm, #Thickness 3mm, #Optical Infrared Window

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Categories	Sapphire Wafer
Brand Name:	ZMSH
Model Number:	Sapphire Wafer
Certification:	rohs
Place of Origin:	CHINA
MOQ:	25
Price:	by case
Payment Terms:	T/T
Supply Ability:	1000pcs per month
Delivery Time:	2-4 weeks
Packaging Details:	package in 100-grade cleaning room
Materials:	99.999% Al₂O₃
Diameter:	60.04mm
Thickness:	3.04mm
Thermal Conductivity:	42 W/m·K
Bending Strength:	350 MPa
Applications:	Optoelectronic Devices, Semiconductors & Microelectronics