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Diamond Wire Triple-Station Single-Wire Cutting Machine for SiC / Sapphire / Silicon Processing

Diamond Wire Triple-Station Single-Wire Cutting Machine Introduction

Diamond Wire Triple-Station Single-Wire Cutting Machine for SiC/Sapphire/Silicon Processing

The Diamond Wire Triple-Station Single-Wire Cutting Machine is a fully automated precision machining system specifically designed for processing highly complex hard and brittle materials. Featuring a modular design, it integrates three independent workstations for rough cutting, precision finishing, and polishing. Equipped with a high-rigidity gantry structure and nano-grade linear motor drive system (repeat positioning accuracy ±0.5μm), the machine utilizes a single diamond wire (diameter 0.1-0.3mm) to sequentially complete multi-process machining, enabling one-stop precision manufacturing from blank to finished product. It is particularly suitable for high-end process scenarios requiring special-shaped cutting, ultra-thin wafer processing, and low surface damage, comprehensively supporting precision machining needs for semiconductor and optoelectronic materials including silicon, silicon carbide (SiC), sapphire, and quartz.

Diamond Wire Triple-Station Single-Wire Cutting Machine Technical Specifications

Model	Three station diamond single line cutting machine
Maximum workpiece size	600*600mm
Wire running speed	1000 (MIX) m/min
Diamond wire diameter	0.25-0.48mm
Line storage capacity of supply wheel	20km
Cutting thickness range	0-600mm
Cutting accuracy	0.01mm
Vertical lifting stroke of workstation	800mm
Cutting method	The material is stationary, and the diamond wire sways and descends
Cutting feed speed	0.01-10mm/min (According to the material and thickness)
Water tank	150L
Cutting fluid	Anti rust high-efficiency cutting fluid
Swing angle	±10°
Swing speed	25°/s
Maximum cutting tension	88.0N (Set minimum unit0.1n)
Cutting depth	200~600mm
Make corresponding connecting plates according to the customer's cutting range	-
Workstation	3
Power supply	Three phase five wire AC380V/50Hz
Total power of machine tool	≤32kw
Main motor	1*2kw
Wiring motor	1*2kw
Workbench swing motor	0.4*6kw
Tension control motor	4.4*2kw
Wire release and collection motor	5.5*2kw
External dimensions (excluding rocker arm box)	485921902184mm
External dimensions (including rocker arm box)	485921902184mm
Machine weight	3600ka

Diamond Wire Triple-Station Single-Wire Cutting Machine Working Principle

1. Three-Station Collaborative Operation:

Station A (Rough Cutting): High-speed cutting (1-2m/s) for rapid shaping, leaving 0.05mm allowance.
Station B (Precision Finishing): Low-speed precision trimming (0.5m/s) with accuracy up to ±0.01mm.
Station C (Polishing): Chemical mechanical polishing (CMP) or laser treatment achieves surface roughness Ra<0.2μm.

2. Intelligent Control System:

PLC-based synchronization ensures seamless process transitions.
Machine vision positioning (5μm accuracy) automatically calibrates cutting paths.

Diamond Wire Triple-Station Single-Wire Cutting Machine Features and Compatible Materials

Feature	Description	Material Characteristics
Three-Process Integration	Reduces workpiece handling, lowering contamination rate by 90%	Silicon (ultra-thin wafers <50μm), SiC (high hardness)
High-Precision Special-Shaped Cutting	Supports complex shapes (arcs/bevels) with profile accuracy ±0.02mm	Sapphire (optical grade), quartz (low thermal expansion)
Adaptive Tension Control	Real-time wire tension adjustment (20-50N) prevents breakage	Ceramics (AlN/Al₂O₃), composite substrates
Multi-Material Compatibility	Quick parameter switching for different materials	Special crystals (LiNbO₃), CVD diamond

Diamond Wire Triple-Station Single-Wire Cutting Machine Technical Advantages

Efficiency: Three-station continuous processing reduces cycle time by 40%.
Quality: Polishing station achieves surface damage layer <10nm, improving device performance by 20%.
Flexibility: Independent station operation adapts to R&D and small-batch needs.
Intelligence: IoT data tracking with real-time monitoring of cutting force and temperature.

Diamond Wire Triple-Station Single-Wire Cutting Machine core application areas

1. Semiconductor Power Device Manufacturing:

SiC MOSFET Trench Processing: Three-station collaboration first rough-cuts trench profiles, then precision-finishes sidewalls (±0.1° angle tolerance), and finally polishes to achieve trench surface roughness Ra<10nm, significantly enhancing switching performance.
Ultra-Thin IGBT Wafer Dicing: For silicon wafers <50μm thick, "descending + oscillating" composite cutting technology controls chipping to <5μm with >99.8% yield.

2. Consumer Electronics Optical Components:

3D Curved Sapphire Cover Processing: Rough-cuts basic contours, precision-finishes curved surfaces (radius R0.5mm±0.01mm), and polishes to achieve >93% transmittance for smartphone camera modules and smartwatch screens.
Micro-Prism Array Fabrication: Processes micron-level prism structures (50-200μm depth) on quartz glass, ensuring array pitch error <1μm.

3. Advanced Research & Special Engineering:

Fusion Device Window Material Processing: Special-shaped cutting of CVD diamond (0.3-1mm thickness) avoids graphitization, maintaining thermal conductivity >2000W/m·K.
Aerospace Ceramic Thermal Protection Components: Microchannel cutting (0.1mm width/1mm depth) on AlN substrates achieves channel wall roughness Ra<0.1μm, reducing fluid resistance.

Diamond Wire Triple-Station Single-Wire Cutting Machine FAQ

1. Q: What are the benefits of 3-station diamond wire cutting?
A: It combines rough cutting, precision finishing, and polishing in one system, reducing processing time by 40% and improving surface quality (Ra<0.2μm).

2. Q: Which materials can be processed with this machine?
A: Hard/brittle materials like SiC, sapphire, silicon, quartz, and ceramics with ±0.01mm precision.

Tags: #Diamond Wire Triple-Station Single-Wire Cutting Machine, #SiC/Sapphire/Silicon Processing

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Categories	Wire Saw Machine
Brand Name:	ZMSH
Model Number:	Diamond Wire Triple-Station Single-Wire Cutting Machine
Certification:	rohs
Place of Origin:	CHINA
MOQ:	3
Price:	by case
Payment Terms:	T/T
Supply Ability:	1000pcs per month
Delivery Time:	3-6 months
Packaging Details:	package in 100-grade cleaning room
Model:	Three station diamond single line cutting machine
Wire running speed:	1000 (MIX) m/min
Diamond wire diameter:	0.25-0.48mm
Cutting accuracy:	0.01mm
Water tank:	150L
Swing angle:	±10°
Workstation:	3