Customized ESD JEDEC IC Trays SGS Compliant For Semiconductor Packaging Shippers

Product Description:

• The outline dimensions of all JEDEC matrix trays are 12.7 x 5.35 inches (322.6 x 136mm). Low profile trays with thickness of 0.25-inch (6.35mm) accommodate 90% of all standard components, such as BGA, CSP, QFP, TQFP, QFN, TSOP and SOIC. A high profile 0.40-inch (10.16mm) version is available to hold thick (high) components such as PLCC, CERQUAD, PGA (Pin Grid Arrays), modules and assemblies.

• JEDEC trays are stackable within the same device family and maker's model. Mixing multiple manufacturers' brands is not recommended, even within the same device family, due to small differences from brand to brand. While JEDEC trays may be stacked several feet high, in normal practice, stacking is limited to 5 to 7 trays.

Technical Parameters:

Applications:

• When JEDEC developed its matrix tray standard outline, all focus was placed on the external size and features. The interior was intentionally left undefined and unrestricted. This left the door open for the matrix tray outline to be used for an unlimited variety of products and components.

• The first JEDEC Trays were designed for the semiconductor industry. These trays are often referred to as IC matrix trays. This continues to be the most common use with trays used for through-hole devices like PGA, DIP, and TO packages; surface mount devices like, QFP, BGA, TSOP, and FP packages; and leadless devices like LGA, QFN, and LCC packages.

• Today, other electronic components like connectors, sockets, adapters, PCBs, MEMS, and a wide range of small assemblies are handled in JEDEC matrix trays to facilitate assembly and pick-and-place processing. Non-electronic components, including lenses, watch parts, formed metal pieces, even synthetic stones, are processed in JEDEC outline matrix trays so that standardized automation equipment can be used.