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| Categories | System On Module SoM | 
|---|---|
| Brand Name: | Neardi | 
| Model Number: | LCB3566 | 
| Place of Origin: | Shanghai, China | 
| MOQ: | 1 piece | 
| Price: | Negotiable | 
| Payment Terms: | L/C,D/A,D/P,T/T | 
| Supply Ability: | 10000/pieces/mon | 
| Delivery Time: | 7 days | 
| Packaging Details: | 33.5×19×9 cm | 
| SoC: | RK3566 | 
| Supplier Type: | OEM/ODM | 
| CPU: | 4 * Cortex-A55 | 
| GPU: | ARM G52 2EE | 
| NPU: | The build-in NPU supports INT8/INT16/FP16/BFP16 MAC hybrid operation. | 
| VPU: | 4K/1080P | 
| DDR: | LPDDR4/LPDDR4X, 1GB/2GB/4GB/8GB (Optional) | 
| eMMC: | eMMC 5.1, 8GB/16GB/32GB/64GB/128GB (Optional) | 
| Working Temperature: | Enterprise Grade: -20°C to 70°C Industrial Grade: -40°C to 85°C | 
| PCB interface: | B2B, 240 Pin | 
| Embedded: | Yes | 
| OS: | Android / Ubuntu / Buildroot / Debian | 
| Application: | IoT Gateways/Autonomous Navigation | 
| Company Info. | 
| Shanghai Neardi Technology Co., Ltd. | 
| Verified Supplier | 
| View Contact Details | 
| Product List | 
The LCB3566 is a high-performance core module built around Rockchip’s RK3566 platform, featuring a compact 62mm × 40mm design. It connects to the baseboard using two Amphenol 0.8mm pitch dual-row 120-pin board-to-board connectors and is secured with four M2 screws, ensuring a stable, reliable, and easy-to-maintain connection.
Integrated Key Components:
• CPU: Rockchip RK3566, designed for efficiency and performance
• RAM: LPDDR4 memory with low power consumption and high frequency, available in 2GB, 4GB, and 8GB configurations
• Storage: High-speed eMMC 5.1, offering capacities from 4GB to 128GB
• Power Management: RK809 PMU with DC-DC and LDO components, supporting DVFS (Dynamic Voltage and Frequency Scaling) for optimized power efficiency
Optimized for Seamless Development
The LCB3566 follows a modular design philosophy, exposing all functional pins of the CPU while adhering to strict industry standards. It has undergone comprehensive testing and large-scale validation, ensuring stability for various applications. By leveraging this module, developers can accelerate product development, minimize costs, and enhance operational efficiency.
| Function | Description | 
| CPU | RK3566, 22nm process, quad-core 64-bit Cortex-A55 | 
| GPU | ARM G52 2EE, OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1, high quality 2D Graphics Engine build in | 
| NPU | The build-in NPU supports INT8/INT16/FP16/BFP16 MAC hybrid operation. | 
| VPU | 4KP60 H.265/H.264/VP9 video decoder 1080P60 H.264/H.265 video encoder 8M ISP | 
| DDR | LPDDR4/LPDDR4X RAM is available in optional capacities of 1GB, 2GB, 4GB, or 8GB. | 
| eMMC | eMMC 5.1 storage, with options for 8GB/16GB/32GB/64GB/128GB (Optional). | 
| PMU | RK806 | 
| OS | Android / Ubuntu / Buildroot / Debian | 
| Camera Interface | Compatible with the MIPI Alliance Interface specification v1.2 Up to 4 data lanes, 2.5Gbps maximum data rate per lane One interface with 1 clock lane and 4 data lanes Two interfaces, each with 1 clock lane and 2 data lanes Support up to 16bit DVP interface (digital parallel input) Support ISP block(Image Signal Processor) | 
| Display Interface | RGB/ BT656/BT1120/ MIPI_DSI_V1.2/ LVDS/ HDMI2.0/Edp1.3/ EBC Support dual screen simultaneous HDR10/HDR HLG/ HDR2SDR/SDR2HDR 3D-LUT/P2I/CSC/BCSH/DITHER/CABC/GAMMA/COLORBAR | 
| USB Interface | 1 x USB3.0 HOST, 3 x USB2.0 HOST, 1 x USB2.0 OTG | 
| PCIe Interface | 1x PCIe2.1 with 1lane | 
| SATA Interface | 2 x SATA3.0 | 
| Audio Interface | I2S0 with 8 channel TX and RX I2S1 with 8 channel TX and RX I2S2/I2S3 with 2 channel TX and RX PDM with 8channel TDM supports up to 8 channels for TX and 8 channels RX path | 
| Connectivity | Compatible with SDIO 3.0 protocol GMAC 10/100/1000M Ethernet Controller Four on-chip SPI controllers Ten on-chip UART controllers inside Six on-chip I2C controllers Smart Card with ISO-7816 Sixteen on-chip PWMs(PWM0~PWM15) with interrupt-based operation Multiple groups of GPIO 4 single-ended input channels SARADC with 10bits resolution up to 1MS/s sampling rate | 
| Operating temperature | Enterprise Grade: -20°C to 70°C Industrial Grade: -40°C to 85°C | 
| PCB interface | B2B,240Pin | 
| PCB layers | 8 layers | 
| PCB size | L* W *H(mm):62 *40 * 8.3(PCB thickness 1.6mm) | 
| Wiki Documentation: | http://wiki.neardi.net/docs/welcome | 
| GitHub: | https://github.com/neardiGitLab: https://gitlab.com/neardiSDK | 
| Repository: | https://gitlab.com/neardi-linux | 
| Forum: | https://forum.neardi.com | 
| Video Tutorials: | https://www.youtube.com/@neardichannels | 

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