Low shrinkage TIS580-20 One Component Dealcoholized Room Temperature Cured Thermally Conductive silicone Adhesive

TIS™580-20 Series is dealcoholized, one component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective.

TIS™580-20 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use.

TIS™580-20 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.

Feature

> Good thermal conductivity: 2.0W/mK

> Good maneuverability and good adhesion

> Low shrinkage

> Low viscosity, leads to void-free surface

> Good solvent resistance, water resistance

> Longer working life

> Excellent thermal shock resistance

Application

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.