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8W/MK Silicon Thermal Pad Gap Filling For Mainboard/Mother Board

Categories Thermal Conductive Pad
Brand Name: ZIITEK
Model Number: TIF™700HQ
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 1000pcs/bag
Products name: 8W/MK Silicon Thermal Pad Gap Filling For Mainboard/Mother Board
Construction & Compostion: Ceramic filled silicone elastomer
Thermal conductivity: 8.0W/m-K
Hardness: 45±5 Shore 00
Thickness range: 0.5mmT~5.0mm
Application: Electronic Component Gap Filling
Operating temp: -45~200℃
Keywords: Thermal Pad
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  • Product Details
  • Company Profile

8W/MK Silicon Thermal Pad Gap Filling For Mainboard/Mother Board

8W/MK Silicon Thermal Pad Gap Filling For Mainboard/Mother Board
The TIF™700HQ Series thermally conductive interface materials are applied tofill the air gaps between the heating elements and the heat dissipation finsor the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features

> Good thermal conductivity
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

Applications


> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices

Typical Properties of TIF700HQ Series
ColorGrayVisual
Construction &CompostionCeramic filled silicone elastomer******
Thickness0.020"(0.5mm)~0.200"(5.0MM)ASTM D374
Specific Gravity3.0g/ccASTM D792
Hardness45±5 Shore 00ASTM 2240
Continuos Use Temp-45 to 200℃***
Dielectric Breakdown Voltage>5500 VACASTM D149
Dielectric Constant5.0 MHzASTM D150
Volume Resistivity1.0X10¹² Ohm-meterASTM D257
Fire rating94 V0UL E331100
Thermal conductivity8.0W/m-KASTM D5470

Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.


Company profile


Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

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