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Thermal Conductive Silicone Pad For Notebook Memory Motherboard Display Insulated CPU North-South Computer Accessories

Categories Silicone Thermal Pad
Brand Name: Ziitek
Model Number: TIF800QE
Certification: UL & RoHS
Place of Origin: China
MOQ: 1000pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
Delivery Time: 3-5 work days
Packaging Details: 24*13*12cm cartons
Products name: Thermal Conductive Silicone Pad For Notebook Memory Motherboard Display Insulated CPU North-South Computer Accessories
Thermal Conductivity: 13.0W/mK
Thinkness range: 0.030"(0.75mm)~0.200"(5.00mm)
Keywords: Thermal Conductive Silicone Pad
Color: Gray
Flam rating: 94 V-0
Hardness: 35 Shore 00
Features: Naturally tacky needing no further adhesive coating
Application: Notebook Memory Motherboard Display Insulated CPU North-South Computer
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  • Product Details
  • Company Profile

Thermal Conductive Silicone Pad For Notebook Memory Motherboard Display Insulated CPU North-South Computer Accessories

Thermal Conductive Silicone Pad For Notebook Memory Motherboard Display Insulated CPU North-South Computer Accessories


Company Profile


Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


TIF®800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal conductivity, enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.


Features:
> Excellent thermal conductivity 13.0W/mK

> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options

> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance


Applications:
> Heat dissipation structure for radiators

> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles

> LED drivers and lamps

> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply

Typical Properties of TIF®800QE Series
ColorGrayVisual
Construction & CompostionCeramic filled silicone elastomer******
Specific Gravity3.7g/ccASTM D297
thickness0.030"(0.75mm)~0.200"(5.00mm)ASTM D374
Hardness (thickness<1.0mm)35 (Shore 00)ASTM 2240
Continuos Use Temp-40 to 200℃******
Dielectric Breakdown Voltage≥5500 VACASTM D149
Dielectric Constant8.0MHzASTM D150
Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
Fire rating94 V0equivalent UL
Thermal conductivity13.0W/m-KASTM D5470

Standard Thicknesses:


0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)


Consult the factory to alternate thickness.


Product Specification
Product Thicknesses: 0.03"(0.75mm)~0.200"(5.00mm) with increments of 0.01(0.25mm)
Product Sizes:16" x 16"(406mm x406mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided hardening).
Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
Notes:FG (Fiberglass) provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).
The TIF series is available in custom shapes and various forms.For other thicknesses or more information, please contact us.

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated.


FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.


Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.


Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

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