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| Categories | eMMC5.1 |
|---|---|
| Brand Name: | PG |
| Model Number: | G2516GMLCA |
| Place of Origin: | China |
| Price: | Negotiable |
| Payment Terms: | L/C, T/T |
| Supply Ability: | 100K a month |
| Delivery Time: | 10 to 15 days |
| Capacity: | 8GB-512GB |
| Agreement: | HS400 |
| Read speed: | Up to 330MB/s |
| Write speed: | Up to 240MB/s |
| Operating temperature: | -25℃~+85℃ |
| Choice of Flash: | MLC/3DTLC/QLC NAND |
| MOQ: | 50pcs |
| Company Info. |
| China Chips Star Semiconductor Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
| Model | G2564GTLCA | G25128TLCA | G25256TLCA | G25512TLCA |
| NAND flash | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND |
| Capacity | 64GB | 128GB | 256GB | 512GB |
| CE | 1 | 2 | 4 | 4 |
| Read speed | up to 330MB/s | up to 330MB/s | up to 330MB/s | up to 330MB/s |
| Write speed | up to 240MB/s | up to 240MB/s | up to 240MB/s | up to 240MB/s |
| Operating temperature | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ |
| EP | ≥3000 | ≥3000 | ≥3000 | ≥3000 |
| Packaging specification | BGA 153 | BGA 153 | BGA 153 | BGA 153 |
| Size | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.2mm | 11.5mmx13mmx1.2mm |
Technical details of eMMC chip
Pin definition
PCB design considerations
Advantages of eMMC chips
Suitability for mobile devices
Data security and reliability
In short, eMMC chips play a crucial role in modern mobile devices due to their high efficiency, reliability and easy integration.

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