Syringe Air Pressure 0-2.0Kpa Micro Dispensing Valve HS-PF-PUR30CC for Assembly Applications

30CC PUR Jetting Valve

1. PUR Injection Valve Composition: The PUR injection valve is comprised of several modules: a drum heating module, a pressurized cap module, a nozzle heating module, a flow path module, a valve body module, and a heat dissipation module.
2. Barrel Heating Module Function: The barrel heating module supports the barrel and provides controlled, single-stage heating to initiate the gel warming process.
3. Pressurized Cap Module Role: The pressurized cap module ensures the drum remains sealed and pressurized, managing the output pressure through a controller.
4. Heat Dissipation Module Efficiency: The heat dissipation module efficiently dissipates heat and minimizes noise generated by the valve body.
5. Modular Design of Piezoelectric Injection Valve: The piezoelectric injection valve adopts a modular design. The gel-contacting section is designated as the runner module, while the non-contacting section comprises the valve body module.
6. Flow Path Module Customization: The flow path module can be tailored to meet dispensing requirements across diverse applications.
7. Nozzle Diameter Range: Nozzle diameters are available in a range spanning from 40µm to 500µm.
8. Nozzle Types: Nozzles are classified into three types: flat jet, needle, and extension.
9. Runner Module and Nozzle Cleaning: Runner modules require regular cleaning in an ultrasonic cleaner, with the caution to avoid immersing seals in organic solvents. Nozzle cleaning necessitates the use of special tools to prevent damage.

Nozzle and barrel heating

1. Before dispensing, the nozzle must be heated to an appropriate temperature. The heating device utilizes a two-stage heating mode for this purpose.

2. By maintaining a constant temperature at the nozzle, the gel's optimal performance is ensured, allowing the colloid to function at its best.

Specification

Advantages

1. Barrel Heating Compatibility: The barrel heating system is compatible with hot melt adhesives of various volumes, including 30cc, 100cc, and 300cc.
2. Modular Design Advantages: Featuring a modularized design, it allows for easy part replacement, straightforward debugging, and a broad range of process applications.
3. Spray Precision: The spray volume can achieve an accuracy of 0.3nL, with a spray adhesive spot consistency accuracy as high as 98%.
4. Fine Line and Spot Capabilities: The hot melt glue spraying process can achieve a minimum line width of 0.17mm and a minimum spot diameter of 0.15mm.
5. Motion Platform Compatibility: It can be seamlessly integrated with any motion platform available in the market.

Application Field
SMT/FPC/PCB,Assembly, flat panel display assembly, semiconductor packaging, LED industry, medical equipment industry,Non-marking lingerie industry.

Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012 by prefessional and experienced engineer who wroked many years in EMS company,we specilized in PCB handling equipments at first, then we develop the PCB depaneling machine and SMT cleaning machine. HSTECH not only have professional technical team for R&D,but also have a outgoing and experienced marketing team for research and develop, grasps products developing directions, updates the products and technics to meet the continue changing demands. In the past years,we have been always keep innovating and exploing to make cost-efficient products to help our customers saving cost and labor, improving the production efficiency at the same time.
HSTECH set the goal for "High quality and Smart”, that based on the concept of "Quality-Oriented and Customer-orented", and combined the industry feature, smart technology persuit for the smart factory.As for the after-sale service, we insist on "responsibility", we will take reaction at the first when we got quality feedbacks,and service our customers all the time.