Sign In | Join Free | My futurenowinc.com
futurenowinc.com
Products
Search by Category
Home > Solar Energy Products >

Exceptional Thermal Performance 1.5W Thermal Gap Pad For Mainboard / Mother Board

Categories Silicone Thermal Pad
Brand Name: Ziitek
Model Number: TIF1120-15-02F Series
Certification: UL & RoHS
Place of Origin: China
MOQ: 1000pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
Delivery Time: 3-5 work days
Packaging Details: 24*23*12cm cantons
Products Name: Exceptional Thermal Performance 1.5W Thermal Gap Pad for Mainboard/mother board
Thermal conductivity: 1.5W/m-K
Fire rating: 94 V0
Dielectric Breakdown Voltage: >5500 VAC
Outgassing(TML): 0.35%
Specific Gravity: 2.3g/cc
Hardness: 60±5
keywords: Thermal Gap Pad
Application: Mainboard/mother board
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

Exceptional Thermal Performance 1.5W Thermal Gap Pad For Mainboard / Mother Board

Exceptional Thermal Performance 1.5W Thermal Gap Pad for Mainboard/mother board


Company Profile


With professional R&D capabilities and over 18 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


The TIF1120-02F Series is an extremely soft gap filling material rated at a thermal conductivity of 1.5W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. ZiitekTIF1120-15-02F is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.


TIF100-02F-Datasheet-REV02.pdf


Features


> RoHS compliant 1.5W/mK
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance
> Supplied with protective liners for ease of use
> Electrically isolating
> High durability


Applications


> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules


Typical Properties of TIF1120--15-02F Series
Color
Gray
Visual
Composite Thickness
Thermal Impedance @10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20
Specific Gravity
2.3 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness range0.020"(0.5mm) to 0.200"(5.0mm)
ASTM C351
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
60±5 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Dielectric Breakdown Voltage

>5500 VAC
ASTM D412
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp

-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Outgassing(TML)
0.35%
ASTM E595
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.0 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X10¹²"
Ohm-meter
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
1.5W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Standard Thicknesses:


0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm)

0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm)

0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)


Consult the factory alternate thickness.


Standard Sheets Sizes:


8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:


Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.


Reinforcement:


TIF™ series sheets type can add with fiberglass reinforced.



Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.


Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.


Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .


Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.


Quality Exceptional Thermal Performance 1.5W Thermal Gap Pad For Mainboard / Mother Board for sale
Send your message to this supplier
 
*From:
*To: Dongguan Ziitek Electronical Material and Technology Ltd.
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0