Supermini Chip Placement Quick Changeover IC Bonder CBD2200

Special use type high precision IC bonder, for a variety of small batch of placement products. It can automatically switch to a variety of bonding heads, and quickly realize the placement of different parameters of a variety of chips.

Features:

• Supermini chip placement
• Ultrathin die bonding technology
• Automatic nozzle change
• Bottom photo-taking, high precision placement
• Quick changeover

Main application:

It is suitable for a variety of small batch of placing products, automatically switch to a variety of mounting head, quickly achieve to place a variety of chip with different. It is mainly used in the military products RF and power module power amplifier.

Product Parameters:

Notices:

1.Leakage protection switch: ≥100ma

2.Compressed air requirement: 0.4-0.6Mpa

Inlet pipe specification: Ø10mm

3.Vacuum requirement:<-88kPa

Inlet pipe specification: Ø10mm

Tracheal joint: 2 pieces

4.Power requirements:

①Voltage: AC220V, frequency 50/60HZ

②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA.

5.The ground is required to withstand a pressure of 800kg/m².

Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering machine, vertical oven, printer and etc has always maintained a leading position in technology, and provided professional electronic equipment solutions for many well-known enterprises at home and abroad.

With modern industrial parks and advanced R&D facilities, Suneast technology has strong system integration capabilities in R&D, design, production, automation and information equipment manufacturing. Its sales network is all over the world. Suneast technology has been achieved technical strategic cooperation with Tsinghua University, Chinese University of Hong Kong, Hong Kong University of Science and Technology and Harbin Institute of Technology, and its R&D capabilities has reached the advanced level at home and abroad.

In the core area of Guangdong-Hong Kong-Macao Greater Bay Area, Suneast technology has served semiconductor back-end application customers for more than 40 years, its downstream and end customers include Huawei, ZTE, TCL, Hikvision, MLS LIGHTING, DBG, DESAYSV AUTOMOTIVE, SHENZHEN MTC, JFLED, etc.

The dual drive gantry synchronous follow linear motor technology has been successfully applied to a number of high-speed and high-precision equipment manufacturing and processing fields, and gains great praise by users. The new semiconductor packaging equipment, like chip bonder is the masterpiece of Suneast technology, which helps the development of domestic chip industry. Today, Suneast technology has become the leader of China's intelligent equipment industry.

As the core enterprise of Sino ICT Holdings, Suneast technology will strengthen the strategic goal of the group and become a world-class enterprise in the field of high technology.

Culture

Vision

To be the leader in the global SMT intelligent equipment industry and the champion in the semiconductor equipment sub-industry!

Maintain leading technology level, R&D strength, industrial scale, and management model, and become the leader of the global SMT intelligent equipment industry and the champion of the semiconductor equipment sub-industry!

  Mission