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| Categories | Dispensing Valve |
|---|---|
| Brand Name: | HSTECH |
| Model Number: | HS-YD-PUR300CC |
| Certification: | CE |
| Place of Origin: | China |
| MOQ: | 1 PC |
| Price: | Negotiable |
| Payment Terms: | T/T, Western Union, MoneyGram |
| Supply Ability: | 100 sets per week |
| Delivery Time: | 7~9 work days |
| Packaging Details: | Carton package |
| Product Name: | PUR Piezo Valve |
| Application: | Bonding And Sealing Of Cell Phone Shells |
| Weight: | 15Kg |
| Material In Contact With Fluid: | Stainless Steel 303, Special Steel |
| Fluid Inlet Size: | Luer Connector |
| Applicable Viscosity Range: | 0-20000cps |
| Company Info. |
| Shenzhen Hansome Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
High Temperature Resistant Material PUR Piezo Valve with Luer Connector
Principle & Control
PUR Piezo Valve
Piezo Valve Controller
Nozzle and drum heating
Specification
| Model | HS-YD-PUR30CC | HS-YD-PUR300CC |
| Size (L*W*H) | 120mm*50mm*140mm | See attached drawing |
| Weight | 0.75kg | 1500g |
| Material in contact with fluid | Stainless steel 303, special steel | Stainless steel 303, special steel |
| Fluid inlet size | Luer connector | Luer connector |
| Needle assembly | Tungsten steel wear-resistant material Φ0.6-Φ3.0mm | Tungsten steel wear-resistant material Φ0.6-Φ2.1mm |
| Nozzle assembly | Tungsten steel wear-resistant material Φ0.03~0.8mm | Tungsten steel wear-resistant material Φ0.05~0.3mm |
| Heating assembly | 20~220℃ | 20~220℃ |
| Fluid seals | High temperature resistant material | High temperature resistant material |
| Maintenance intervals for seal assemblies | 20,000,000 times | 20,000,000 times |
| Maximum dispensing frequency | 1000Hz (Instantaneous maximum frequency 1500Hz) | 1000Hz (Instantaneous maximum frequency 1500Hz) |
| Maximum drive power | 100% | 100% |
| Type of glue used | PUR hot melt adhesive 300CC aluminum cylinder packaging | PUR hot melt adhesive 300CC aluminum cylinder packaging |
| Applicable viscosity range | 0-20000cps | 0-20000cps |
| Fluid temperature range | 80~220℃ | 20~220℃ |
Product Features and Advantages
Application Field
Bonding and sealing tasks encompass a variety of applications, such as assembling cell phone shells, encapsulating new energy batteries, adhering and sealing touch screens for diverse electronic devices, enclosing cell phone speakers and receivers, covering high-end headphones and audio housings, as well as encapsulating fingerprint recognition modules.
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