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25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished

Categories RF PCB Board
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Material: RF-10
Layer count: 2-layer
PCB size: 163.9mm x 104.9mm=2Types =2PCS, +/- 0.15mm
PCB thickness: 25mil
Copper weight: 1oz (1.4 mils) outer layers
Surface finish: Immersion tin
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25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished

RF-10 PCBs are advanced composites of ceramic-filled PTFE and woven fiberglass, designed for high-performance RF applications. Offering a high dielectric constant and low dissipation factor, RF-10 provides exceptional dimensional stability and ease of handling for multilayer circuits.


Key Features:

Dielectric Constant: 10.2 ± 0.3 at 10GHz
Dissipation Factor: 0.0025 at 10GHz
High Thermal Conductivity: 0.85 W/mk (Unclad)
CTE: x 16 ppm/°C, y 20 ppm/°C, z 25 ppm/°C
Low Moisture Absorption: 0.08%
Flammability Rating: V-0

Benefits:

High DK for RF circuit size reduction
Excellent dimensional stability
Tight DK tolerance
High thermal conductivity for enhanced thermal management
Strong adhesion to smooth coppers
Low X, Y, Z expansion
Excellent price/performance ratio


RF-10 Typical Values
PropertyTest MethodUnitValueUnitValue
Dk @ 10 GHzIPC-650 2.5.5.5.1 Mod.10.2 ± 0.310.2 ± 0.3
Df @ 10 GHzIPC-650 2.5.5.5.1 Mod.0.00250.0025
TcK† (-55 to 150 °C)IPC-650 2.5.5.6ppm/°C-370ppm/°C-370
Moisture AbsorptionIPC-650 2.6.2.1%0.08%0.08
Peel Strength (1 oz. RT copper)IPC-650 2.4.8 (solder)lbs/in10N/mm1.7
Volume ResistivityIPC-650 2.5.17.1Mohm/cm6.0 x 107Mohm/cm6.0 x 107
Surface ResistivityIPC-650 2.5.17.1Mohm1.0 x 108Mohm1.0 x 108
Flexural Strength (MD)IPC - 650 - 2.4.4psi14,000N/mm296.53
Flexural Strength (CD)IPC - 650 - 2.4.4psi10,000N/mm268.95
Tensile Strength (MD)IPC - 650 - 2.4.19psi8,900N/mm262.57
Tensile Strength (CD)IPC - 650 - 2.4.19psi5,300N/mm237.26
Dimensional StabilityIPC-650 2.4.39 (After Etch)% (25 mil-MD)-0.0032% (25 mil-CD)-0.0239
Dimensional StabilityIPC-650 2.4.39 (After Bake)% (25 mil-MD)-0.0215% (25 mil-CD)-0.0529
Dimensional StabilityIPC-650 2.4.39 (After Stress)% (25 mil-MD)-0.0301% (25 mil-CD)-0.0653
Dimensional StabilityIPC-650 2.4.39 (After Etch)% (60 mil-MD)-0.0027% (60 mil-CD)-0.0142
Dimensional StabilityIPC-650 2.4.39 (After Bake)% (60 mil-MD)-0.1500% (60 mil-CD)-0.0326
Dimensional StabilityIPC-650 2.4.39 (After Stress)% (60 mil-MD)-0.0167% (60 mil-CD)-0.0377
Density (Specific Gravity)IPC-650-2.3.5g/cm32.77g/cm32.77
Specific HeatIPC-650-2.4.50J/g°C0.9J/g°C0.9
Thermal Conductivity (Unclad)IPC-650-2.4.50W/M*K0.85W/M*K0.85
CTE (X -Y axis) (50 to 150 °C)IPC-650 2.4.41ppm/°C16-20ppm/°C16-20
CTE (Z axis) (50 to 150 °C)IPC-650 2.4.41ppm/°C25ppm/°C25
Flammability RatingInternalV-0V-0


This PCB features a precise stackup configuration comprising Copper_layer_1 and Copper_layer_2 each measuring 35μm (1oz) in thickness, sandwiching the RF-10 Core layer at 25 mil (0.635mm). With a board size of 163.9mm x 104.9mm ± 0.15mm, the PCB maintains a minimum trace/space of 4/4 mils for optimal signal integrity and component spacing.


Mechanically, this PCB offers a minimum hole size of 0.5mm and a finished board thickness of 0.75mm, ensuring structural stability and flexibility during installation. The copper weight of 1oz (1.4 mils) on the outer layers, along with a 20 μm via plating thickness, supports efficient signal transmission and secure interconnections between layers.


It is finished with Immersion Tin for enhanced solderability and protection against oxidation. A white top silkscreen aids in component identification, while a green top solder mask provides environmental protection. Rigorous 100% electrical testing before shipment guarantees quality and adherence to design specifications, ensuring reliable performance in diverse applications.



The artwork format for this PCB follows the industry-standard Gerber RS-274-X format, ensuring compatibility with common design tools and manufacturing processes. Adhering to the IPC-Class-2 quality standard, the PCB meets stringent criteria for manufacturing and assembly, guaranteeing reliable performance in various applications.


With availability worldwide, the RF-10 PCB offers global accessibility for projects and industries requiring high-performance RF solutions.


Applications:

Microstrip Patch Antennas
GPS Antennas
Passive Components (filters, couplers, power dividers)
Aircraft Collision Avoidance Systems
Satellite Components


PCB Material:Composites of Ceramic Filled PTFE and Woven Fiberglass
Designation:RF-10
Dielectric constant:10.2
Dissipation Factor0.0025 10GHz
Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm )
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..
Quality 25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished for sale
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