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| Categories | High Speed PCB | 
|---|---|
| Brand Name: | Bicheng | 
| Certification: | UL, ISO9001, IATF16949 | 
| Place of Origin: | CHINA | 
| MOQ: | 1PCS | 
| Price: | USD9.99-99.99/PCS | 
| Payment Terms: | T/T | 
| Supply Ability: | 5000PCS per month | 
| Delivery Time: | 8-9 working days | 
| Packaging Details: | Vacuum bags+Cartons | 
| Material: | RT/duroid 6006 | 
| PCB size: | 65.33mm x 59.89 mm=1PCS, +/- 0.15mm | 
| Copper weight: | 1oz (1.4 mils) outer layers | 
| Surface finish: | Immersion silver | 
| Layer count: | 2-Layer | 
| PCB Thickness: | 0.7 mm | 
| Company Info. | 
| Bicheng Electronics Technology Co., Ltd | 
| Verified Supplier | 
| View Contact Details | 
| Product List | 
In the rapidly advancing world of electronics, the need for high-performance printed circuit boards (PCBs) is paramount. The RT/duroid 6006 PCB stands out as an exceptional solution for microwave and electronic circuit applications, designed specifically to meet the demands of high-frequency environments. This article delves into the features, specifications, and advantages of the RT/duroid 6006, emphasizing its importance in modern circuit design.
Material Composition and Characteristics
The RT/duroid 6006 is a ceramic-PTFE composite that provides
outstanding dielectric properties. With a dielectric constant (Dk)
of 6.15 ± 0.15 at 10 GHz, it enables significant reductions in
circuit size while maintaining performance. This high Dk allows
engineers to design compact circuits without compromising
functionality.
Key Electrical Properties
Dissipation Factor: The RT/duroid 6006 boasts a low dissipation
factor of 0.0027, ensuring minimal signal loss during operation.
This characteristic is crucial for applications that demand high
efficiency, particularly in RF and microwave circuits.
Thermal Stability: With a thermal stability exceeding 500 °C, the
RT/duroid 6006 can withstand extreme temperatures, making it
suitable for demanding environments. Its thermal coefficient of
dielectric constant is -410 ppm/°C, indicating stable performance
across a wide temperature range (-50°C to 170°C).
Moisture Absorption: The PCB exhibits a moisture absorption rate of just 0.05%, enhancing its reliability, especially in humid conditions. This low moisture absorption contributes to the longevity and performance consistency of the circuits.
| Property | RT/duroid 6006 | Direction | Units | Condition | Test Method | 
| Dielectric Constant,εProcess | 6.15±0.15 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline | |
| Dielectric Constant,εDesign | 6.45 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0027 | Z | 10 GHz/A | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -410 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 | 
| Volume Resistivity | 7 x 107 | Mohm.cm | A | IPC 2.5.17.1 | |
| Surface Resistivity | 2 x 107 | Mohm | A | IPC 2.5.17.1 | |
| Tensile Properties | ASTM D638 (0.1/min. strain rate) | ||||
| Young's Modulus | 627(91) 517(75) | X Y | MPa(kpsi) | A | |
| Ultimate Stress | 20(2.8) 17(2.5) | X Y | MPa(kpsi) | A | |
| Ultimate Strain | 12 to 13 4 to 6 | X Y | % | A | |
| Compressive Properties | ASTM D695 (0.05/min. strain rate) | ||||
| Young's Modulus | 1069 (115) | Z | MPa(kpsi) | A | |
| Ultimate Stress | 54(7.9) | Z | MPa(kpsi) | A | |
| Ultimate Strain | 33 | Z | % | ||
| Flexural Modulus | 2634 (382) 1951 (283) | X | MPa(kpsi) | A | ASTM D790 | 
| Ultimate Stress | 38 (5.5) | X Y | MPa(kpsi) | A | |
| Deformation under load | 0.33 2.1 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 | 
| Moisture Absorption | 0.05 | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 | |
| Thermal Conductivity | 0.49 | W/m/k | 80℃ | ASTM C518 | |
| Coefficient of Thermal Expansion | 47 34 117 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 | 
| Td | 500 | ℃ TGA | ASTM D3850 | ||
| Density | 2.7 | g/cm3 | ASTM D792 | ||
| Specific Heat | 0.97(0.231) | j/g/k (BTU/ib/OF) | Calculated | ||
| Copper Peel | 14.3 (2.5) | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Mechanical Properties
The mechanical characteristics of the RT/duroid 6006 further enhance its applicability:
Young's Modulus: With values of 627 MPa in the X-direction and 517
MPa in the Y-direction, the material provides robust mechanical
strength.
Ultimate Stress: The ultimate stress values of 20 MPa (X) and 17
MPa (Y) indicate its capacity to withstand significant mechanical
loads.
Coefficient of Thermal Expansion (CTE): The CTE values are 47 ppm/°C (X), 34 ppm/°C (Y), and 117 ppm/°C (Z), ensuring dimensional stability across varying temperatures.
PCB Construction and Specifications
This PCB features a well-engineered construction:
Stackup: 2-layer rigid PCB
Copper Layer 1: 35 μm
RT/duroid 6006 Core Thickness: 0.635 mm (25 mil)
Copper Layer 2: 35 μm
Dimensions: 65.33 mm x 59.89 mm (±0.15 mm)
Finished Thickness: 0.7 mm
Surface Finish: Immersion Silver, enhancing solderability and
protecting the copper layers.
This PCB supports a minimum trace/space of 5/5 mils and a minimum hole size of 0.5 mm, providing flexibility in design and manufacturing.
Advantages of RT/duroid 6006 PCBs
The RT/duroid 6006 offers a plethora of advantages:
High Dielectric Constant: Facilitates compact designs without
sacrificing performance.
Low Loss Characteristics: Ideal for high-frequency applications,
ensuring reliable signal transmission.
Reliable Plated Through-Holes: Enhances connectivity and mechanical
integrity in multi-layer board designs.
| PCB Material: | Ceramic-PTFE Composites | 
| Designation: | RT/duroid 6006 | 
| Dielectric constant: | 6.15 | 
| Dissipation Factor | 0.0027 10GHz | 
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB | 
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) | 
| PCB thickness: | 10mil(0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.905mm), 100mil(2.54mm) | 
| PCB size: | ≤400mm X 500mm | 
| Solder mask: | Green, Black, Blue, Yellow, Red etc. | 
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. | 

Diverse Applications Across Industries
The versatility of the RT/duroid 6006 PCB makes it suitable for
various applications, including:
Patch Antennas: Perfect for compact designs in wireless
communication.
Satellite Communications Systems: Provides reliable signal
transmission in space applications.
Power Amplifiers: Enhances performance in RF and microwave
circuits.
Aircraft Collision Avoidance Systems: Critical for safety and
reliability in aviation technology.
Ground Radar Warning Systems: Ensures accurate information in
defense applications.
Quality Assurance and Standards
Each PCB undergoes rigorous testing, including a 100% electrical
test prior to shipment, adhering to IPC-Class-2 standards. This
commitment to quality ensures that every unit delivered meets the
highest performance criteria.
Conclusion
The RT/duroid 6006 PCB represents a significant advancement in PCB
technology, offering unmatched performance for high-frequency
applications. Its exceptional dielectric properties, mechanical
strength, and reliability make it an essential choice for engineers
and designers in various industries. By integrating RT/duroid 6006
into your projects, you can maximize performance, reliability, and
efficiency, paving the way for innovation in microwave and
electronic circuit design. Explore the possibilities with RT/duroid
6006 and elevate your designs to new heights!
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