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Categories | Desktop Mini PC |
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Place of Origin: | Guangdong, China |
Brand Name: | WPNA |
Packaging Details: | carton, bubble bag, stecth film |
Price: | Negotiable |
MOQ: | 50 units |
Supply Ability: | 10000 Piece/Pieces per Month |
Certification: | CE/FCC/RoHs/ISO9001/CCC |
Payment Terms: | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
Delivery Time: | 15-30 WORKDAYS |
Product Name: | Mini host |
Use: | For Business |
Operating System: | Windows 10/11/Ubuntu/Linux |
CPU: | Optional |
RAM: | 4GB/8GB/16GB/32GB optional |
HDD/SSD: | 128GB/286GB/512GB/1TB/2TB |
Warranty(Year): | 1-Year |
After-sales Service: | Return and Replacement |
Company Info. |
Guangzhou Weipuna Technology Development Co., Ltd. |
Verified Supplier |
View Contact Details |
Product List |
I3 Processor Intel Mini Pc Win10 2 Ethernet Buy I3 Micro Desktop Computer
CPU | N2840/N2940/J1800/J1900/J4125 | |||
Memory | 4G/8G/16G/32G(optional) | |||
hard disk | 64G/128G/256G/512G/1TB(optional) | |||
Operating System | Windows 7/Windows 8/Windows 10/Linux | |||
front panel ports | 2*LAN,1*HDMI, 1* Power Switch,1*VGA,1*AUD | |||
Backside ports | 2*COM, 2*USB3.0,2*USB2.0,1*SW | |||
Output | DC 12V~19V/5A | |||
Operating Temperature | 0/70 Centigrade(32F~140F) | |||
Storage Temperature | -20/+85 Centigrade | |||
Relative Humidity | 0%~90% (non-condensing) | |||
Size | 200*180*80mm | |||
Weight | 1.5KG |
Product Highlight
The Mini host uses a highly integrated miniaturized design to condense the computing core, storage module and functional interface into an extremely compact body. It adopts a low-power architecture and efficient heat dissipation solution to achieve fanless operation. With the help of intelligent power management and modular expansion technology, it can complete the full function output of the traditional host in a limited space. At the same time, it supports flexible deployment in multiple scenarios and ecological interconnection, achieving a precise balance between performance and volume.
Technology
The Mini host adopts precision microelectronic packaging technology, integrating core components into a compact PCB through high-density SMT patch technology, combined with CNC one-piece metal frame to enhance structural strength, supplemented by laser etching for precise openings, and then undergoes multi-layer nano-coating for dust and heat dissipation treatment. Finally, it passes fully automated assembly and harsh environment testing to ensure stability and durability under the miniaturized body.
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