Light Weight white 1.8W / mK Thermal Conductive Plastic with 150℃ Heat Deflection Temperature for Power transformers
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... conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Superior Casting Grade Epoxy Resin for All Voltage CT 0.4-0.8W/mk Thermal Conductivity
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Product Description: One of the standout features of our casting grade epoxy resin is its low solubility, ensuring that it creates a long-lasting bond with your materials. This also means that it won't break down or degrade over time, offering excellent ......
Shanghai Wenyou Industry Co., Ltd.
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Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting
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Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting TIS™ 680-10AB Series is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue. lt is design for ......
Dongguan Ziitek Electronical Material and Technology Ltd.
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Flame Retardant Thermally Conductive Encapsulant Dustproof For Power Battery
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Low Thermal Resistance 0.8W/m.K Thermally Conductive Silicone Encapsulant For Power Battery Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/......
Shenzhen Aochuan Technology Co., Ltd
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Single Part DOWSIL TC-5121C Thermal Grease 2.8W/MK Pump Out Resistant Electronics Cooling
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...Thermal Grease | Single-Part 2.8W/mK Pump-Out Resistant Electronics Cooling Basic Product Properties TC-5121 C is a single-part, non-curing thermal grease with greenish-yellow viscosity. It delivers 2.8W/mK thermal conductivity, low thermal resistance (0.09℃·cm²/W), and pump-out resistance, designed for mid-to-high-end electronics thermal......
Shenzhen Huazhisheng New Material Technology Co., Ltd.
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TIE280-15AB Two-Component Thermal Conductive 1.5W/Mk Epoxy Resin Potting Compound For Circuit Board
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... Two-Component Thermal Conductive 1.5W/Mk Epoxy Resin Potting Compound For Circuit Board Product Summary: TIE™ 280-15AB Series is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue. lt......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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0.8W/MK Double Sided Heat Sink Tape Thermal Conductivity 13mm Roll Width
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Special shape heat conductive material , double-sided adhesive tape. These heat conductive silicon products are applied to sink, PCBA, because of their high heat dissipating capacity and electrial isolation performance, as well as their high heat ......
Boalv New Material Technology Co., Ltd.
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9508H One-Component Heat-Curing Type TC >8.0 W/M·K Excellent Workability Low Static / Transient Stress On Substrates
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9508H TDS-EN.pdf 9508H is one-component Heat-curing type; TC >8.0 W/M·K; Excellent workability and Low static/transient stress on substrates Product Description Light green gel One-component heat-curing type Silicone thermal conductive composite Product ......
Shanghai Huitian New Material Co., Ltd
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Grey Electronic Potting Silicone Rubber Compound Flame Resistant Encapsulant Silicone
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Grey Electronic Potting Silicone Rubber Componud Flame Resistant Encapsulant Silicone Item No.: RTV160A/B Appearance(A/B) A: Grey liquid B:White liquid Viscosity(A/B,Mpa.s) 3700±2000 Mix ratio (A/B) 1:1 Pot life after curing(25℃,min) 30-40 Curing time (hrs......
MINGCHENG GROUP LIMITED
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