1.4W/M.K LED Thermal Interface Pad , Conductive Thermal Gap Filler Pad Reusable
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... interface between electronic components and heat sink or product outer covering. Specifications: 1. Thermal conductivity 1.0 W/M.K~6.0W/M.K 2. Thickness 0.2-20mm 3. Customized 4. Easy to install APPLICATION * Communication equipment * LED lighting *...
SZ PUFENG PACKING MATERIAL LIMITED
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High conductivity 4w Thermal Conductive Pad 2mmT naturally tacky Silicone 55 psi Thermal Pad -40 to 160℃ for IGBTs
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..., adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Ziitek TIF180-40-16E is recommended for...
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Nontoxic Thermally Conductive Interface Pads
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1.4W/m.K Thermal Conductivity High Performance Insulation Pad Yellow Silicone Thermal Sheet Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - Color Yellow Visual Thickness(mm) 0.25 astm d374 Usage Temperature(℃) -40~......
Shenzhen Aochuan Technology Co., Ltd
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Two Part Thermal Interface Materials Blue Liquid Dispensable Thermal Gap Filler Gel
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Two Part Liquid Dispensable Gap Filler Thermal Gel Tflex CR607 Laird Dual Tubes 6.4W MK Product Description At 6.4 W/m-K thermal conductivity, Tflex™ CR607 is at the forefront of thermal performance for a two-part, cure in place dispensable gap filler......
ZSUN CHIPS CO., LTD
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