MT47H64M16HR-3 IT:H 1GBIT Dram IC 84FBGA Parallel Integrated Circuits
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... Memory Size 1Gbit Memory Organization 64M x 16 Memory Interface Parallel Clock Frequency 333 MHz Write Cycle Time - Word, ......
J&T ELECTRONICS LTD
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1Gbit Memory IC MT29F1G01ABBFDWB-IT:F 8-UPDFN Integrated Circuit Chip 83MHz
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1Gbit Memory IC MT29F1G01ABBFDWB-IT:F 8-UPDFN Integrated Circuit Chip 83MHz Product Description Of MT29F1G01ABBFDWB-IT:F MT29F1G01ABBFDWB-IT:F is Asynchronous 1Gbit SPI NAND FLASH Memory IC, package is 8-UPDFN (8x6) (MLP8). Specification Of ......
ShenZhen Mingjiada Electronics Co.,Ltd.
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Data Storage Memory IC Chip Dram IC IS42S16400F-6TL 16 Bit for Automotive
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Memory Data Storage Semiconductors Memory ICs DRAM IS42S16400F-6TL 16 Bit Product Range Memory Data Storage Semiconductors Memory ICs DRAM IS42S16400F-6TL DRAM 64M, 3.3v, SDRAM, 4Mx16 16 bit App Characteristics Clock frequency: 200, 166, 143, 133 MHz ......
KZ TECHNOLOGY (HONGKONG) LIMITED
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MT48LC4M16A2TG Synchronous Dram IC MICRON TSOP4 Meg X 4 X 4 Banks
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MT48LC4M16A2TG Synchronous Dram MICRON Original Package TSOP Tray MT48LC16M4A2 – 4 Meg x 4 x 4 banks GENERAL DESCRIPTION The Micron® 64Mb SDRAM is a high-speed CMOS, dynamic random-access memory containing 67,108,864 bits. It is internally configured as a ......
DELI ELECTRONICS TECHNOLOGY CO.,LTD
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W9725G6KB-25 DRAM ic Chip DDR2 SDRAM 256Mbit 16Mx16 1.8V 84-Pin WBGA
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W9725G6KB-25 DRAM ic Chip DDR2 SDRAM 256Mbit 16Mx16 1.8V 84-Pin WBGA DRAM Chip DDR2 SDRAM 256Mbit 16Mx16 1.8V 84-Pin WBGA 1. GENERAL DESCRIPTION The W9725G6KB is a 256M bits DDR2 ......
Angel Technology Electronics Co
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MT48LC4M16A2TG-75 IT:G TR Synchronous Dram IC MICRON TSOP4 Meg X 4 X 4 Banks
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MT48LC4M16A2TG Synchronous Dram MICRON Original Package TSOP Tray MT48LC16M4A2 – 4 Meg x 4 x 4 banks GENERAL DESCRIPTION The Micron® 64Mb SDRAM is a high-speed CMOS, dynamic random-access memory containing 67,108,864 bits. It is internally configured as a ......
ChongMing Group (HK) Int'l Co., Ltd
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DRAM IC ESD Component Tray For Electronics Parts Packing
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DRAM IC ESD Component Tray For Electronics Parts Packing Enhance automation and protection with JEDEC trays designed around your product, not the other way around. Features: 1. Designs conform to the JEDEC international standard and have strong versatility. 2. Optimal product design can provide a variety of packaging ICs......
Shenzhen Hiner Technology Co., Ltd.
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Tenting process 25um DRAM IC package Substrate BT material 4 Layer
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Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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AS4C32M16SC-7TIN Programmable IC Chips 512Mb 32Mx16 3.3V 143MHz DRAM IC
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AS4C32M16SC-7TIN Electronic Components IC Chips Integrated Circuits IC Alliance Memory PRODUCT DESCRIPTION Part number # AS4C32M16SC-7TIN is manufactured by Alliance Memory Technologies and distributed by Jalixin. As one of the leading distributors of ......
Hong Kong Jia Li Xin Technology Limited
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MT41J128M16JT-107:K DRAM ICs 2G 128Mx16 DDR3 Datasheet
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MT41J128M16JT-107:K DRAM 2G 128Mx16 DDR3Multipurpose register 1.Features VDD = VDDQ = 1.5V ±0.075V • 1.5V center-terminated push/pull I/O • Differential bidirectional data strobe •8n-bit prefetch architecture • Differential clock inputs (CK, CK#) • 8 ......
Shenzhen Hongxinwei Technology Co., Ltd
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