Self-Adhesive Thermal Gap Pad 0.3mm to 5.0mm Thick 6.0W/M·K Silicone Thermal Pad
|
Self-Adhesive Thermal Gap Pad 0.3mm to 5.0mm Thick 6.0W/M·K Silicone Thermal Pad TS-TIF®100C 6050-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
|
TIF100-01ES Self-Adhesive Thermal Gap Pad 6.0W/M·K Silicone Thermal Pad
|
...Gap Pad 6.0W/M·K Silicone Thermal Pad Product descriptions TlFTM100-07S Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductivity 1.5W/mK......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
|
3.0W/MK Silicone Thermal Pad 27shore00 For Heat Pipe Thermal Solutions
|
...0W/mK high cost-effective silicone thermal pad 27shore00 For Heat pipe thermal solutions Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIF500-30-11U Datasheet-REV02.pdf The TIF5140-30-11U is a highly compliant Gap Pad......
Dongguan Ziitek Electronical Material and Technology Ltd.
|
Bergquist 1.0W/m-k Gap Pad Vo Ultra Soft Thermal Silicone Gasket GPVOUS
|
Bergquist 1.0W/m-k Gap Pad Vo Ultra Soft thermal silicone gasket GPVOUS Product features/Applications: Thermal conductivity: 1.0 W/m-K. highly conformable, low hardness,“Gel-like” modulus. Puncture, shear and tear resistan, electrically isolating. ......
SZ PUFENG PACKING MATERIAL LIMITED
|
Thermally Conductive Material Thermal Conductive Silicone Gap Pad
|
... thermal conductivity of 1.1 W/mK with high conformability, this gap filler produces low thermal resistance. The alumina filler allows the product to remain a cost effective solution where moderate thermal ......
Adcol Electronics (Guangzhou) Co., Ltd.
|
3.0W/MK Cooling Pad 6KV Breakdown Voltage Heat Sink Pad for Industrial Heat Dissipation
|
Product Description: Our Thermal Conductive Silicone Pad boasts an impressive elongation of 100%, making it highly flexible and resistant to tearing. With a hardness rating of 60 Shore A, this pad is firm enough to provide the necessary support and ......
Shenzhen Linmao Electronic Material Co.,Ltd.
|
Ultrasoft Heatproof PC Thermal Pad , 1W Gap Pad Thermal Conductivity
|
Ultra Soft Low Resistance 1.0W/m.K Thermal Conductivity Silicon Thermal Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced Fiberglass - Color White and Brick Red Visual Thickness(mm) 0.5~12.0 ASTM D374 Density(g/cc) 2.5 ......
Shenzhen Aochuan Technology Co., Ltd
|
Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad
|
...Pad Gap Filler Silicone Free Tflex SF10 Laird Thermal Conductivity 10 W/Mk Product Description Tflex SF10 is an innovative high performing thermal material in Laird’s gap filler portfolio. The silicone free material measures 10 W/mk and has excellent deflection properties which provides minimal pressure on components. Very little pressure is required to reach the lowest possible thermal resistance. Features and Benefits Silicone......
ZSUN CHIPS CO., LTD
|
Submit your “2 0w mk silicone gap pad” inquiry in a minute :