3.0w/Mk Routers Computer Thermal Pads Volume Resistivity 1.0*1012 Ohm-Cm
                                         
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                                            3.0W/mK high cost-effective silicone pads for routers, Volume Resistivity 1.0*1012 Ohm-cm Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in ......                                         
                                        
                                            Dongguan Ziitek Electronical Material and Technology Ltd.
                                         
                                        
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High Temperature Silicone Thermal Pad 0.23MPa Tensile Strength For Industrial
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                                            Product Description: The Heat Sink Thermal Pad is available in various thicknesses ranging from 0.3mm to 15mm, making it suitable for use in a wide range of applications, including computers, LED lighting, power supplies, and other electronic devices. With......                                         
                                        
                                            Shenzhen Antac Technology Limited
                                         
                                        
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3W/MK Soft Silicone Thermal Pad Insulating Sheet for Computer CPU GPU Chip Heat Sink Heatsink Cooling Thermal Conductive Pad
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                                            Product Description: Our Thermal Conductive Silicone Pad is made of silicone, a durable material that can withstand high temperatures and harsh environmental conditions. With a hardness of 45 ShoreC and a tensile strength of 3 MPa, this Thermal Heat Sink ......                                         
                                        
                                            Shenzhen Linmao Electronic Material Co.,Ltd.
                                         
                                        
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3W/m·K 0.3~10mm High Thermal Conductivity Electronic Components Heat Conducting Fin
                                         
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                                            3W/m·K high thermal conductivity electronic components heat conduction plate Product features/Applications: High cost performance, high thermal conductivity, low thermal resistance. High adherence, soft and elastic, easy to install, can be repeatedly ......                                         
                                        
                                            SZ PUFENG PACKING MATERIAL LIMITED
                                         
                                        
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Pink Low Resistance Thermal phase chaging materials Interface Pad For Computer Serves 0.95 W/MK
                                         
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                                            ...Thermal phase chaging materials Interface Pad For Computer Serves 0.95 W/MK The TIC™803P Series is low melting point thermal interface material. At 50℃, The TIC™800P Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal......                                         
                                        
                                            Dongguan Ziitek Electronic Materials & Technology Ltd.
                                         
                                        
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