3.2 W/Mk Thermal Gap Pad Specific Gravity 3.0g/Cc For Set Top Boxes
|
3.2 W/mK Specific gravity 3.0g/cc Thermal Gap Pad for Set top boxes The TIF160-32-05US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
|
45 Shore 00 Thermal Gap Filler 3.2W/M-K 3.0g/Cc For GPS Navigation
|
45 Shore 00 thermal gap filler 3.2W/M-K,Specific Gravity :3.0g/cc For GPS navigation and other portable devices Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which ......
Dongguan Ziitek Electronical Material and Technology Ltd.
|
AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity
|
|
Low Thermal Resistance Thermal Conductive Silicone Pad For CPU With Die-Cuting Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2.3 ASTM D792 Hardness (Shore OO) 20±5 ......
Shenzhen Aochuan Technology Co., Ltd
|
