TIF100C 6530-11 Excellent Thermal Conductivity 6.5W/MK Thermal Gap Filler Pad For CPU And GPU Processors
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...Thermal Conductivity 8.0W/MK Thermal Gap Filler Pad For CPU And GPU Processors Product descriptions TS-TIF®100C 6530-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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3.0W/MK Thermal Gap Filler 27shore00 For Heat Sinking Housing At LED-Lit BLU In LCD
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3.0W/mK professional factory thermal gap filler 27shore00 For Heat Sinking Housing at LED-lit BLU in LCD Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively ......
Dongguan Ziitek Electronical Material and Technology Ltd.
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Telecommunication Hardware blue 5.0W/mK Thermal Gap Filler Materials 2.75 g/cc, thermal silicone rubber pad 45 shore00
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Telecommunication Hardware Gap Fillers Materials With High Thermal Conductivity Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Grey Thermal Gap Filler Pad Material Silicone Based Thermal Conductivity
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...Thermal Gap Filler Thermal Pad Laird Thermal Conductivity 7.5W/Mk Grey High Deflection Product Description Laird’s Tflex™ HD7.5 gap filler is a new developed very soft silicone material in our high deflection series. With a thermal conductivity of 7.5W/ mk......
ZSUN CHIPS CO., LTD
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1.4W/M.K LED Thermal Interface Pad , Conductive Thermal Gap Filler Pad Reusable
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... interface between electronic components and heat sink or product outer covering. Specifications: 1. Thermal conductivity 1.0 W/M.K~6.0W/M.K 2. Thickness 0.2-20mm 3. Customized 4. Easy to install APPLICATION * Communication equipment * LED lighting *...
SZ PUFENG PACKING MATERIAL LIMITED
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Thermal Gap Filler Thermal Conductive Material Thermal Pad 30 seconds Hardness
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... of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal resistances. A-gapfill 600 is naturally tacky and...
Adcol Electronics (Guangzhou) Co., Ltd.
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RoHS Multiscene Gap Filler Pad , Acrylate Thermal Pad For Electronics
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0.5mm Thickness Green Silicone Free Thermal Pad For Hard Disc Driver Attribute Value Test Method Composition Acrylate - Color Green Visual Thickness(mm) 0.5-10.0 ASTM D374 Density(g/cc) 2.9 ASTM D792 Hardness(shore oo) 45±5 ASTM D2240 Usage Temperature(℃)......
Shenzhen Aochuan Technology Co., Ltd
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