TIF100C 6530-11 Excellent Thermal Conductivity 6.5W/MK Thermal Gap Filler Pad For CPU And GPU Processors
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...Thermal Conductivity 8.0W/MK Thermal Gap Filler Pad For CPU And GPU Processors Product descriptions TS-TIF®100C 6530-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Rohs 4.0 W Mk Silicone Thermal Gap Filling Pad For Smd Led Module , Gray Color
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RoHs Easy release construction silicone pads for SMD LED module gray color The TIF1180-40-11US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Factory Price Hot Selling Thermal Conductive Silicon Pad 8W/MK Silicone Thermal Gap Filling
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...Thermal Conductive Silicon Pad 8W/MK Silicone Thermal Gap Filling Ziitek TIF700Q use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal......
Dongguan Ziitek Electronical Material and Technology Ltd.
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Pink Thermally Conductive Gap Filler Pads Silicone Based Tflex HD300
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... line of products. Tflex HD300 is an excellent choice when wide manufacturing tolerances occur. These variable gaps can be filled with Tflex HD300 while generating minimal board and component stress. Laird's unique manufacturing capabilities, filler and...
ZSUN CHIPS CO., LTD
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7.3mm 2W/MK Thermal Conductive Pad For LED Lighting , Non Silicone Gap Filler Pads
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2.0W non silicone thermal interface conductive gap pad thermal gap filler LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or ......
SZ PUFENG PACKING MATERIAL LIMITED
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Thermal Gap Filler Thermal Conductive Material Thermal Pad 30 seconds Hardness
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... of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal resistances. A-gapfill 600 is naturally tacky and...
Adcol Electronics (Guangzhou) Co., Ltd.
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