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5 0 W Mk Phase Change Material

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5 0 w mk phase change material

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2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required

2.5 W / mK Phase Changing Materials For IGBTs Cache Chips High Thermal Conductive The TIC™803A Series is low melting point thermal interface material. At 50℃, The TIC™800A Series begins to soften and flow, filling the microscopic irregularities of ......

Dongguan Ziitek Electronic Materials & Technology Ltd.

Address: No.12 Xiju Road,, Hengli Township, 523460 Dongguan City

2.5W/mK Thermally Conductive Phase Change Material Customization Phase Change Gasket

Thermally conductive phase change material Specification customization Phase change gasket Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally ......

Dongguan Ziitek Electronical Material and Technology Ltd.

Address: No.12 Xiju Road,, Hengli Township, Dongguan City, 523460 Guangdong Province, China

TIM Thermal Interface Materials Electronics Thermal Phase Change Material ROHS

.... With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to enhance the cooling of the most rigorous thermal challenges in electronics. Softening between 50°C – 70°C, the initial pad thickness can ......

ZSUN CHIPS CO., LTD

Address: D202-A208, Building D, Guanghong Meiju, No. 163, Pingxin North Road, Hehua Community, Pinghu Street, Longgang District, Shenzhen, Guangdong, China

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