5CEFA7F27I7N FBGA-67 Intel Integrated Circuit RAM 48 Bit
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5CEFA7F27I7N FBGA-67 Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to ......
Shenzhen Tengshengda ELECTRIC CO., LTD.
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THGBMNG5D1LBAIL Memory IC Chip 4 GB eMMC Memory IC FBGA-153 Package
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THGBMNG5D1LBAIL Memory IC Chip 4 GB eMMC Memory IC FBGA-153 Package Product Description Of THGBMNG5D1LBAIL THGBMNG5D1LBAIL is 4 GB eMMC Memory IC,the package is FBGA-153. Specifications Of THGBMNG5D1LBAIL Package/Case: FBGA-153 Memory Size: 4 GB Minimum ......
ShenZhen Mingjiada Electronics Co.,Ltd.
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Customized JEDEC Matrix Trays Loading FBGA IC ESD Rohs Raw Material
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Customized JEDEC Matrix Trays Loading FBGA IC ESD Rohs Raw Material Protect your ICs from electrostatic discharge and mechanical stress with JEDEC-compatible trays built for cleanroom and factory use. Hiner-pack offers the ultimate protection and ......
Shenzhen Hiner Technology Co., Ltd.
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EP3C55F484I7N FBGA-484 Electronic Components Integrated Circuit IC
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EP3C55F484I7N EP3C55F484I7N FBGA-484 Electronic Components Integrated Circuit IC To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided. We attach great importance to ......
HK LIANYIXIN INDUSTRIAL CO., LIMITED
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DDR4 4Gb SDRAM Chip 32Mx4 FBGA-96 1.2V 8K Refresh IMD256M16R4ABD8LY
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DDR4 4Gb SDRAM Memory Chip Refresh IMD256M16R4ABD8LY DDR4 SDRAM IMD256M16R4ABD8LY – 32 Meg x 16 x 8 Banks Features VDD = VDDQ = 1.2V ±60mV VPP = 2.5V, –125mV/+250mV On-die, internal, adjustable VREFDQ generation 1.2V pseudo open-drain I/O TC of 0°C to 85......
Shenzhen Filetti Technology Co., LTD
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XQ2VP40-5FG676 QPRO VIRTEX-II FPGA 676-FBGA Integrated Circuits ICs
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We can supply XQ2VP40-5FG676N , send us a request quote to request XQ2VP40-5FG676N pirce and lead time.https://www.henkochips.com a professional electronic components distributor. With 10+ Million line items of available electronic components can ship in ......
HENKOSINO TECHNOLOGY CO.,LTD
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Xilinx XC3S700AN-4FGG484I Programming Ic Chip Package Case 484-BBGA
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Xilinx XC3S700AN-4FGG484I Programmable IC Chip Product Features: - Xilinx Spartan-3E FPGA - 700K system gates - 4.2Mbits of embedded RAM - 2.5V to 3.3V core voltage - 1.2V to 3.3V I/O voltage - 484-pin FBGA package - Low power consumption - High speed ......
Shenzhen Sai Collie Technology Co., Ltd.
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ENEPIG semiconductor assembly BGA Substrate Hitachi BT raw material
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Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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THGJFCT0T44BAIL TOSHIBA UFS NAND FLASH - 128 Gbyte UFS3.1 BiCS
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THGJFCT0T44BAIL KIOXIA NAND FLASH - 128 Gbyte UFS3.1 BiCS Manufacturer:Kioxia Product Category:UFS RoHS: Details Series:THGJF Memory Size:128 Gbyte Configuration:BiCS Operating Supply Voltage:2.7 V to 3.6 V Minimum Operating Temperature:- 25 C Maximum ......
ICOMPONENTS CO.,LIMITED
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328 Field Programmable Grid Array EP4CE40F23C8N IC FPGA I/O 484FBGA
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EP4CE40F23C8N IC FPGA 328 I/O 484FBGA Mfr Intel Series Cyclone® IV E Package Tray Product Status Active Number of LABs/CLBs 2475 Number of Logic Elements/Cells 39600 Total RAM Bits 1161216 Number of I/O 328 Voltage - Supply 1.15V ~ 1.25V Mounting Type ......
J&T ELECTRONICS LTD
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