12 inch 5nm Smart Semiconductor Wafer Chip / Laser Chip for Smartphone
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This is the leftover material after Jin Yuan is cut, and the wafer can also be taken out. Each chip can take about 130 wafers, and the box is sent by air in a box of three kilograms. It can also be shipped in domestic ports. If necessary, please contact......
Shenzhen Chuangying Times Technology Co., Ltd.
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6 Inch 5 Solts Semiconductor Wafer Carrier For Inspection And Transportation In Wafer Fabrication
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...le sheet of wafer film uniform expansion, so that attached to the surface of the film tightly arranged grains pull apart, in order to facilitate solid crystal. At this time, the expansion of good chip storage is also particularly important, generally many...
Shenzhen Hiner Technology Co., Ltd.
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Ultrasonic Semiconductor Wafer Coating Continuous
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...Semiconductor Wafer Coating Description: Wafer coating is a unique process that facilitates the automatic application of chip bonding adhesives at the wafer level, followed by the formation of chip bonding films in the next stage. FUNSONIC's ultrasonic semiconductor wafer coating technology is suitable for wafer coating, which can achieve process speed, thickness control, and material uniformity. After the hot or UVB stage and wafer...
Hangzhou Qianrong Automation Equipment Co.,Ltd
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AOS AO3442 Semiconductor Wafers Control Electronic Components China Ic Chips Integrated Circuits AO3442
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...Semiconductor Wafers Control Electronic Components China Ic Chips Integrated Circuits AO3442 Welcome to our company! We are a one-stop shop for electronic component procurement. We specialize in providing a wide range of electronic components to meet your diverse needs. Semiconductors......
ShenZhen QingFengYuan Technology Co.,Ltd.
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3.5kW Efficient Semiconductor Wafer Processing Equipment Chip Sorter Machine
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Semiconductor Automatic Slicing Machine Features: Chip Sorting Machine Product Name: Chip Sorting Machine Power Consumption: 2.5kW Sorting Speed: Up To 500 Chips Per Minute Air Consumption: 0.1m³/min Sorting Method: Optical Sorting Air Pressure: 0.6-0.8MPa......
Guangdong Taijin Semiconductor Technology Co., Ltd
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MCP4822T-E MS 8-TSSOP Semiconductor IC Chip High Performance Low Power Consumption for High-Speed Data Processing
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MCP4822T-E MS 8-TSSOP Semiconductor IC Chip High Performance Low Power Consumption for High-Speed Data Processing Product Listing: MCP4822T-E MS Dual 12-Bit Voltage Output Digital-to-Analog Converter Features: • Dual 12-bit voltage output digital-to-analog......
Shenzhen Sai Collie Technology Co., Ltd.
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High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders
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...12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic nozzle change Supermini chip placement Compatible with 8-12 inch wafers......
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
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customized size 5x5 10x10mm size 4h-n 6h-semi sic wafers chips
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4inch dia100m 4H-N type Production grade DUMMY grade SiC substrates, Silicon Carbide substrates for a semiconductor device, 4h-semi 4h-N customized square shape sic wafers Application areas 1 high frequency and high power electronic devices Schottky diodes......
SHANGHAI FAMOUS TRADE CO.,LTD
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STMicroelectronics Semiconductor IC Chip STM32F103RCT6 256KB FLASH 64LQFP
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STMicroelectronics Chip STM32F103RCT6 IC MCU 32BIT 256KB FLASH 64LQFP Manufacturer: STMicroelectronics Product Category: ARM Microcontrollers - MCU RoHS: Details Series: STM32F103RC Mounting Style: SMD/SMT Package / Case: LQFP-64 Core: ARM Cortex M3 ......
HK INTERRA TECHNOLOGY LIMITED
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Fused Silica Wafer JGS1 JGS2 BF33 8inch 12inch Thickeness 750um±25um Ra ≤ 0.5nm TTV ≤ 10um
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Fused Silica wafer JGS1 JGS2 BF33 8inch 12inch thickeness 750um±25um Ra ≤ 0.5nm TTV ≤ 10um Fused Silica wafer JGS1 JGS2 BF33 8inch 12inch‘s summary BF33 wafers, a type of borosilicate glass, are valued for their high resistance to thermal shock and ......
SHANGHAI FAMOUS TRADE CO.,LTD
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