ISO 75Plates Wafer Cutting Machine / Automatic Waffle Making Machine
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...best technical team for machine designing and developing. SKYWIN is new manufacturer for Wafer making machine in CHINA. It is China - Europe Joint Venture company, the shareholders have many years of experience in the manufacturing of wafer equipments. The...
Skywin Foodstuff Machinery Co., Ltd.
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50W Fiber Laser Silicon Wafer Cutting Machine For Solar Photovoltaic Polycrystalline
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...Wafer Cutting Machine for solar photovoltaic industry polycrystalline silicon solar battery Model: PE-20W/50W (II) ★ Product Introduction Perfect Laser launched the latest Full-enclosed Type Fiber laser silicon wafer cutting machine with Dust-proof PE-20W/50W (II), the biggest difference between the first generation is that this laser scribe machine is fully enclosed design, machine......
Perfect Laser (Wuhan) Co.,Ltd.
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2.4KW 60000rpm Wafer Cutting Machine For PCB
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...Wafer Cutting Machine For PCB, IR Filter, Sapphire Glass And Ceramic Features of products • Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese, English, Korean, etc. • Can meet the high precision cutting maximum diameter of 300 mm materials. • High rigidity structure design is adopted to ensure high precision and high stability of cutting process. •Cutting...
YUSH Electronic Technology Co.,Ltd
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High Temperature Refractory Machining Ceramic Parts Silicon Wafer Cutting Machine
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...Machining Ceramic Parts Silicon Wafer Cutting Machine Made from high-tech zirconia, ceramic blades are known for their hardness and durability. They last up to 10x longer than steel. Zirconia, the key material in advanced ceramics, is chemically inert, non-porous, non-stick and impervious to acids, salt, and rust. Chemically inert means no impact or reaction with what you're cutting......
Dongguan Ming Rui Ceramic Technology Co.,ltd
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Ceramic Plate, Aluminum Substrate Wafer Cutting Machine Precision Scribing Machine Weight 600kg
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... efficient cutting mode; the maximum processing workpiece size is 150* 150mm, suitable for small packaging substrate materials, soft materials cutting, manual loading and unloading, automatic transmission and positioning, automatic alignment cutting. 1.The...
YUSH Electronic Technology Co.,Ltd
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Micro-jet Laser Machine For Metal Matrix Composite Processing Wafer Cutting Dicing Slicing
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...machine for Metal matrix composite processing wafer cutting dicing slicing Micro-jet Laser Equipment & Linear Motor for Wafer Dicing and Slicing Product Overview: The Micro-jet Laser Machine is a cutting-edge solution designed for high-precision processing of Metal Matrix Composites (MMCs), along with wafer cutting, dicing, and slicing. Utilizing advanced laser microjet (LMJ) technology, this machine......
SHANGHAI FAMOUS TRADE CO.,LTD
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Ultrasonic Spraying Protective Film Specific Coating Before Silicon Wafer Cutting
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... to be a reliable, repeatable, and efficient method for applying various chemicals to silicon before cutting, grinding, and polishing to protect the wafer and bumps. Common chemical substances include Z-Coat, PMMA, and other easily removable chemicals....
Hangzhou Qianrong Automation Equipment Co.,Ltd
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0.2mm 30W Green Laser Marking Machine , Wafer CO2 Laser Engraving Cutting Machine
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...Machine Crystal Glass Wafer CO2 Laser Engraving Cutting Machine With 3D Focusing System 30W 60W 10.6nm CO2 Laser Marking Crystal Glass Wafer CO2 Laser Engraving Cutting Machine With 3D Focusing System Product Description The green laser marking machine is ......
ZHONGCHI INTELLIGENT TECHNOLOGY(SHENZHEN) CO., LTD
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High-Precision Fiber Laser Cutting Machine for Solar Cell Manufacturing
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... machines for processing semiconductor silicon wafers, ceramic wafers, and other high-tech substrates. The automatic solar cell laser scribing machine ensures high efficiency, accuracy, and durability for industrial applications. Machine Features: The...
Yoha （Wuhan） New Energy Technology Co., Ltd.
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50kg/H Wafer Stick Machine
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...Wafer Stick Machine center filled wafer stick production line 50kg/h (Snack Machine China factory Supplier) 2.paramters: Heating Type Natural Gas Heating Electric Heating Total Power(KW) 8 40 Main Machine Size(MM) 3400×1700×2250 Gas Consumption LPG:4.5KG/H Natural Gas:8-9m3/h Capacity(KG/H) Hollow:25-30 Filled:50-60 Wheel Diameter(MM) 1800 Weight(KG) 4000 YX Wafer......
SHANGHAI PANDA MACHINERY CO.,LTD
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