State - Of - The - Art Piezoelectric Wafer Fabrication For MEMS And SAW Devices Advanced Processing Capabilities For Results
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...Piezoelectric Wafer Fabrication for MEMS and SAW Devices Advanced Processing Capabilities for Results We specialize in providing comprehensive chip foundry services, catering to clients who require high-quality wafer processing and fabrication. By simply providing design schematics and specifications, we deliver tailored solutions that meet your exact needs. Our extensive range of wafers......
Hangzhou Freqcontrol Electronic Technology Ltd.
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STM32F103RBT6TR Mcu Electronics Advanced Processing Capability High Performance
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STM32F103RBT6TR 64-LQFP MCU Microcontroller with Advanced Processing Capability and High Performance STMicroelectronics STM32F103RBT6TR 64-LQFP MCU Microcontroller Unit Product Highlights: - 32-bit ARM Cortex-M3 Core - 16KB of RAM - 128KB of Flash Memory......
Shenzhen Sai Collie Technology Co., Ltd.
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PLC Control 2.0hp Food Processing Equipment For Wafer Making
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...Processing Equipment for Wafer Making Features of Wafer Making Effortless Production Process Say goodbye to labor-intensive and time-consuming methods with the Monaka Wafer Making Machine. This automatic machine takes care of the entire production process, from batter preparation to baking and packaging. With advanced technology and streamlined features, you can create delectable monaka wafers......
GUANGZHOU CITY PENGDA MACHINERIES CO., LTD.
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Aluminum CNC Parts Advanced Machining Capabilities for High-Precision Aluminum Components
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...Advanced Machining Capabilities for High-Precision Aluminum Components Description of Aluminum CNC Parts Advanced Machining Capabilities for High-Precision Aluminum Components Aluminum CNC Parts Advanced Machining Capabilities refer to the state-of-the-art technologies and processes used to manufacture high-precision aluminum components through Computer Numerical Control (CNC) machining. These capabilities......
Shenzhen Xianheng Technology Co.,Ltd
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High Speed Embossed Carrier Tape Forming Machine With Advanced Processing Technology
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AF-45, High Speed Embossed Carrier Tape Forming Machine Applications: Carrier Tape apply to the IC, SMT semiconductors,crystal and other chip components of the SMD tape packaging. Piezoelectric crystal industry specifications:49U/SMD,49S/SMD,UM-1/SMD,UM-5/......
YAOAN PLASTIC MACHINERY CO.,LTD
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Convenient Repair Car Starter Motor Advanced Process For Audi Seat Skoda Volkswagen
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Car Starter Motor Audi Seat Skoda Volkswagen 1.2L 1.4L 1.6L (1999-2010) 02T 911 023E OE Number or Parts Number 1 , Model No : DSQ1002 2 , OE NO / (Part number) : 02T911023G / 02T911023GX / 02T911023E / 02T911023EX / 0001121016 / 0001121017 / 0986018431 / ......
Shanghai Hongshi Mechanical Co., Ltd
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3inch 4inch 6inch Lithium Niobate Single Crystal Thin Film LNOI Wafer <110> <100> <001>
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..., and integrated photonics devices based on lithium niobate thin films (LNOIs) on insulators have been widely developed with the help of advanced micro-nano processing techniques. In the future, high-performance LNOI materials will support the further...
SHANGHAI FAMOUS TRADE CO.,LTD
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SiC Wafers 2/3/4/6/8 /12Inch 4H-N Type Z/P/D/R Grade
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...Wafers 2/3/4/6/8 inch 4H-N Type Z/P/D/R Grade High Quality 1. Abstract Our high-quality 4H-N Type SiC Wafers are available in sizes ranging from 2 to 12 inches, designed for advanced semiconductor applications. Driven by our pursuit of excellence, we are one of the few manufacturers capable of producing 8-inch SiC wafers. Our commitment to high quality and advanced......
SHANGHAI FAMOUS TRADE CO.,LTD
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RDL First WLP Underfill Advanced Packaging Equipment Wafer Level Dispensing Machine
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Advanced RDL First WLP Underfill Wafer-Level Dispensing Machine The evolution of advanced semiconductor devices, such as 2.5D and fan-out wafer-level packaging, demands ultra-reliable underfill processes at the wafer stage. The SS101 is engineered to ......
Changzhou Mingseal Robot Technology Co., Ltd.
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PZT-4 PZT-5 1/ 2 / 3mhz PZT Wafer For Ultrasonic Transducer Sheet / Ultrasonic Oscillator
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...piezoelectric ceramic wafer ultrasonic oscillator 1M 2M 3mhz This specification applies Piezoelectric ceramic change can slice , ,Piezoelectric ceramic in can piece to be applicable to the industry, storage, family, hotel, etc adjust air humidity, smell and liquid drug atomization treatment, etc TM-10MM-1.0BY-2MHZ D 10mm δ 1.0mm Many size specfication can make,,,And Can do steel head processing...
TaiMi(Shenzhen) electronics technology Co.,ltd
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