5.0mmT Thermal Conductive Gap Pad For Automotive Engines -40 To 160℃
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...Thermal Conductive Gap Pad For Automotive Engines,-40 To 160℃ 4.5mmT,20±5 Shore 00 Good performance thermal conductive pad for Automotive engine control units, The TIF1200-30-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal...
Dongguan Ziitek Electronic Materials & Technology Ltd.
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3.0mmT 1.5 W/MK Thermal Conductive Gap Pad For Automotive Engine Control Units
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...thermal conductive gap pad for Automotive engine control units Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering......
Dongguan Ziitek Electronical Material and Technology Ltd.
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TIF100-20-10F Various Thicknesses Thermal Conductive Gap Pad For Automotive IT Infrastructure
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TIF100-20-10F Various Thicknesses Thermal Conductive Gap Pad For Automotive IT Infrastructure Products description Ziitek TIF®100-20-10F series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Automotive Electronics Thermal Conductive Gap Filler
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3.0W/m.K Thermal Conductivity Silicone Gap Filler For UAV With 2.9g/Cc Density Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green Visual Density(g/cc) 2.9 ASTM D792 Extrudability(g/s) 5.0 ISO9048 Usage Temperature(℃) -40~150......
Shenzhen Aochuan Technology Co., Ltd
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BERGQUIST GP3000S30 Battery Pack Gap Filled Thermally Conductive Silicon Pad 3.0W/M-K
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...Gap filled Thermally Conductive silicon Pad 3.0W/m-k Product description : BERGQUIST GP3000S30 Soft thermal conductive material with substrate gap filling. Also known as GAP PAD 3000S30. The new model is GAP PAD TGP 3000. Product Features : Under very low pressure, low S-Series thermal......
SZ PUFENG PACKING MATERIAL LIMITED
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Thermal Conductive Gap , Thermally Conductive Material Filler Electric Thermal Interface Pads
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...thermal transfer are desired. Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis.. A-gaphite 800 can be supplied in 12” x 18” (305mm x 457mm) or 18” x 24”...
Adcol Electronics (Guangzhou) Co., Ltd.
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Thermal Conductive Silicone Pad Insulating Pad for CPU Electronics
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...Thermal Heat Sink Pad is engineered with a high-volume resistivity of 1x10^13 Ω·cm, making it an ideal choice for electrical insulation applications. This ensures that your electronic components remain safe and protected from electrical currents that could potentially damage them. With a 100% elongation factor built into the design, the Silica Gel Thermal gap......
Shenzhen Linmao Electronic Material Co.,Ltd.
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Flexible Soft Thermal Pad Thermal Conductive Silicone Pad ISO
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...Thermal Conductivity Thermal Conductive Silicon Pad For Heat Dissipation Thermal pad is also known as thermal conductive silicone gap filler, thermal gasket, soft thermal pad and other different names. Generally speaking, thermal pad is composed of silicone gel combined with thermal conductive powder to achieve different characteristics such as thermal conductivity, insulation, and compressibility. The thermal conductivity......
Shenzhen Antac Technology Limited
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Dowsil TC-4525 Thermally Conductive Gap Filler 2.5W/m·K for Automotive
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Dowsil TC-4525 Thermally Conductive Gap Filler for Automotive Electronics Cooling Product Attributes Dowsil TC-4525 is a two-part, room temperature cure silicone gap filler with thermal conductivity of 2.5 W/m·K, low compression stress, and controlled ......
Shenzhen Huazhisheng New Material Technology Co., Ltd.
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High Thermally Conductive Interface Pads Gap Filler Thermal Pad Electronics
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... versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device. Tflex HD90000 is available in...
ZSUN CHIPS CO., LTD
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