20 Layer Special Pcb Backdrilling Process On Pad Communication Multilayer
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Backdrilling+Hole On Pad Communication Multilayer PCB The Backdrilling+Hole On Pad Communication Multilayer PCB is the special process PCB circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd. the HDI board is made of FR-4 ......
Quanhong FASTPCB
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FR4 Multilayer PCB HDI Laser Blind Buried Via PCB Board Fabrication
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Multilayer PCB Special Tech Place of Origin: China 1.Impedance 2.Via Filling 3.PFH,Backdrill 4.Mix Finishes 5.Cave 6.Heatsink 7.ENEPIG Brand Name: Highleap Application Segment: Auto,Industrial,Medical,DataCom,Consumer Layer Count: 4~50L Matierial: FR4 (......
Guangzhou Highleap Electronic Co.,Ltd.
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