BT material BGA semiconductor package Substrate production
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... Manufacturer: HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which...
HongRuiXing (Hubei) Electronics Co.,Ltd.
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FCBGA Packaging Jet Underfill Dispenser CUF Inline Cnc Glue Dispenser ISO
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FCBGA Packaging CUF Application Inline Jet Underfill Dispenser The GS600 Series Inline Jet Underfill Dispenser is Mingseal’s next-generation solution engineered specifically for FCBGA encapsulating applications, where process stability, ultra-fine ......
Changzhou Mingseal Robot Technology Co., Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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XC7K160T-L2FBG676E Programmable IC Chip 676-FCBGA Package Embedded FPGAs Automotive Grade Industrial Device 0.93V
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...FCBGA Package Embedded FPGAs Automotive Grade Industrial Device 0.93V Number of LABs/CLBs 12675 Number of Logic Elements/Cells 162240 Total RAM Bits 11980800 Number of I/O 400 Voltage - Supply 0.87V ~ 0.93V Mounting Type Surface Mount Operating Temperature 0°C ~ 100°C (TJ) Package / Case 676-BBGA, FCBGA Supplier Device Package 676-FCBGA......
Shenzhen Sai Collie Technology Co., Ltd.
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BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface
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BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface BGA IC Packaging Solution ESD Stable Surface Resistance Matrix Tray JEDEC Tray/Matrix Tray/IC Tray/ESD Packing ......
Shenzhen Hiner Technology Co., Ltd.
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STM32F439NIH6 Embedded Microcontroller MCU 2MB Flash BGA-216 Package
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...BGA-216 Package Product Description Of STM32F439NIH6 STM32F439NIH6 is a 32-bit RISC processor that features exceptional code-efficiency, delivering the high-performance expected from an Arm core in the memory size usually associated with 8- and 16-bit devices. Specification Of STM32F439NIH6 Part Number: STM32F439NIH6 Package: BGA......
ShenZhen Mingjiada Electronics Co.,Ltd.
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Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof
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... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ......
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......
JIMA Copper
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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PEX8648-BB50RBC G Electronics Integrated Circuits PCI Bus Controller PBGA 676 CMOS FCBGA-676
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...FCBGA-676 Rohs Code Yes Part Life Cycle Code Active Ihs Manufacturer BROADCOM INC Package Description FCBGA-676 Reach Compliance Code compliant HTS Code 8542.31.00.01 Bus Compatibility I2C JESD-30 Code S-PBGA-B676 JESD-609 Code e1 Moisture Sensitivity Level 4 Number of Terminals 676 Package Body Material PLASTIC/EPOXY Package Code BGA Package Shape SQUARE Package......
J&T ELECTRONICS LTD
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