0.26mm BT BGA IC Substrate Board manufacture
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Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.26mm; Material brand:Mainly brand:SHENGYI,......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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Half Hole 0.25mm BGA Multilayer Pcb Board 1.2mm Hdi Pcb Prototype
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... means high density interconnect printed circuit boards, they are characterized by finer lines, closer spaces, and more dense wiring. Due to its higher circuit density than traditional circuit boards, HDI PCB designs can include smaller through holes and...
Huashengxin Circuit Limited
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High Temperature Electronic Aluminum Oxide Al2O3 Ceramics Substrate Board Plate
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... constant and dielectric loss, high thermal conductivity, good chemical stability, and similar thermal expansion coefficient of the component, but the ceramic substrate is brittle and made. The substrate area is small and the...
Wuxi Special Ceramic Electrical Co.,Ltd
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Integrated Circuit Chip S25FL512SAGBHBA10 512Mbit NOR Memory IC 24-BGA IC Chips
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...Circuit Chip S25FL512SAGBHBA10 512Mbit NOR Memory IC 24-BGA IC Chips Product Description Of S25FL512SAGBHBA10 S25FL512SAGBHBA10 is FLASH - NOR Memory IC, 512Mbit SPI - Quad I/O, the package is 24-BGA (8x6). Specification Of S25FL512SAGBHBA10 Part Number......
ShenZhen Mingjiada Electronics Co.,Ltd.
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Impedance BGA PCBA Circuit Board Production For Air Cooler
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...board, Mobile Power PCB board home appliances Bluetooth audio circuit BGA impedance circuit board Essential details Model Number: 1103R04024A Place of Origin: Guangdong, China Brand Name: JIETENG Base Material: FR4, CEM1, CEM3, PI, etc Copper Thickness: 18-140um Board Thickness: 0.3-7.0mm Min. Hole Size: 0.1-0.2mm Min. Line Width: 3/3mil Min. Line Spacing: 3/2.5mil Surface Finishing: LF-HASL, OSP, ENIG, etc. Board......
ShenZhen Jieteng Circuit Co., Ltd.
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BGA PCB Circuit Board Assembly X - Ray Inspection Service OEM PCBA
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BGA PCB Circuit Board Assembly with X-Ray Inspection Service OEM PCBA Quick Detail: PCB Assembly on SMT and DIP PCB schematic drawing/ layout /producing PCBA clone/change board Components sourcing and purchasing for PCBA Enclosure design and plastic injection molding Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA......
Huaswin Electronics Co.,Limited
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F771654BGTP Texas Instrument BGA IC Integrated Circuits Components
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...ICs) F771654BGTP Texas Instrument Integrated Circuits BGA IC components Specification : F771654BGTP Category Integrated Circuits (ICs) Product Name Electronic components Model number F771654BGTP Mfr FAIRCHILD Series IC Components Package Standard package Condition New and original Package Lead time In stock can be shipped ASAP Features - Package / Case BGA......
Angel Technology Electronics Co
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Black Solder Mask IC Substrate PCB 0.2mm RoHS Compliant For Electronic Devices BT materials SD card
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2-Layer Rigid IC Substrate PCBs Green Solder Mask 0.2mm RoHS Compliant *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: ......
LT CIRCUIT CO.,LTD.
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1oz - 2oz HDI PCB Board BGA Printed Circuit Board ENIG Surface Treatment
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... Minimum Via 0.1mm Surface treatment ENIG,OSP Board thickness 0.15-4.5mm Solder mask color Gree,Blue,Black,Red,White Tolerance of board thickness T>=1.0mm, Tol: +/-10% T<1.0mm, Tol:+/-0.1mm 2.HDI capablity and example 1) X+X process ( Layer Drawing)...
Shenzhen Fany Technology Co.,Ltd
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