Precision hot bar press bonding machine equipment of rotary double-position XCM52-B3
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...Machine equipment Rotary pulse hot press machine equipment XCM52-B3 hot bar pressing/bonding machine equipment CWPP-1A 2014 New Pulse hot bar press machine equipment to rework Flat cable Flex cable on the LCD for iPhone and Sumsung through ACF adhesive Pulse Heated Soldering Machine equipment Pulsehotpressmachine equipmentto repair ， Pulsehotbarpressmachine equipmentto repair， single-position hot bar pressing/bonding...
Shenzhen Sunsom automatic equipment Co.,Ltd .
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1200W LCD Cof Bonding Machine , Flex Cable Bonding Machine 450kg 610dh
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Cof Bonding Machine 610dh LCD Flex Cable Repair Machine Manufacture Cof Bonding Machine Description Cof Bonding Machine Equipped with advanced optical alignment system, fully meet the product clear alignment and production precision, high precision ......
Guangzhou Chuang Li You Machinery Equipment Technology Co., Ltd
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Aluminum wire ultrasonic wedge bonding machine for 18650/21700/26650/32650 lithium battery pack assembly
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18650 26650 spot welding machine/ Tesla wire bonding machine Equipment basic working principle: After the module assembly process is completed, the equipment is used to automatically load the system, and then sent to the welding area through the automatic ......
Shenzhen Onetop Technology Co.,Ltd
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32 Inch LCD TV Panel 4500W TAB COF FPC Bonding Machine
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... ic bonding machine Screen repair equipment, LCD repair equipment, hot-press FPC equipment, TAB/COG binding equipment Technical parameters: power: AC220V±10%, 50Hz, 4500W work environment: 10~60℃, 40%~ 95% work air pressure: 0.5 ~ 0.7 Mpa bonding press ......
Shenzhen Wanbo Hi-Tech Co., Ltd.
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Horizontal Electric Foam Bonding Machine For Sponge / PVC / Non Woven Fabric
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...Bonding Machine Used to Bind Some Materials , Sponge / PVC and non-woven Fabric foam sheet (pearl wool) bonding machine is essential special equipment for deep processing. It is used to bond double or multi-layer when the thickness of once forming sheet is insufficient. The thickness after processing can reach 4-100mm thus expand the applied range of PE foam sheet. This machine......
Dongguan Zehui machinery equipment co., ltd
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Silicone Bonding Machine for bonding silicone tube
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...Silicone strip bonding/cutting equipment Specialized for bonding extrusion type silicone rubber gaskets ,clear transparent appearance which swiftly cures to be silicone polymer in high temperature environment ,offering permanent bond of the silicone rubber......
Shenzhen KangLiBang Technology Co., Ltd
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Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment
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...Bonding Machine WBD2200 The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture. Features: Multilayer Capability System-in-Package Capability Ultrathin Die Bonding Technology Supermini Chip Bonding...
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
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N95 / KN95 Mask Edge Bonding Machine For Semi - Automatic Face Mask Machine
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...uld use the Edge bonding machine for bonding edge. Equipment capacity: Depend on different human efficient :20 ～ 250 pcs / min Equipment size: 700*600*1200mm(L*W*H) Equipment weight: about 125 kg Mask specifications: Dimensions: 17.5 X9.5; 1-5 layers;...
Dongguan Zhongli Instrument Technology Co., Ltd.
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High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine
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Semiconductor Packaging Equipment/led/high Precision Die Bonder/die Bonding Machine / Die Attach Die BonderDie Bonder Product name die bonding machine Solid crystal cycle >40 ms Die bonding position accuracy ±0.3 mil Dispensing heating constant ......
Shenzhen Wenzhan Electronic Technology Co., Ltd.
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Semi-automatic Room Temperature Bonding Machine 2/4/6/8/12inch Compatible Material Sapphire Si SiC InP GaAs GaN LT/LN Diamond Glass
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...bonding machine Semi-automatic room temperature bonding machine 2/4/6/8/12inch Compatible material Sapphire Si SiC InP GaAs GaN LT/LN Diamond Glass Semi-Automatic Room Temperature Bonding Machine is a precision device for Wafer-Level or Chip-Level bonding. Mechanical pressure + surface activation technology enables permanent bonding......
SHANGHAI FAMOUS TRADE CO.,LTD
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