MGC brand BT CSP package Substrate Fabrication
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...package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......
JIMA Copper
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Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof
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... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ......
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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SMT Stencil built on 0.12mm stainless steel foil Laser Cut Stainless Steel Shim for CSP Package
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Product profile 1.1 General description This is a type of SMT stencil (100% laser cut) built on 0.12mm stainless steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated per IPC 7525A using supplied Gerber data, squeegee area ......
Shenzhen Bicheng Electronics Technology Co., Ltd
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High Efficiency 300W LED Lighting Engine 8000K Multi Chip CSP LED Module
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... LED Lighting Engine 8000K Multi Chip CSP LED Module Features: 1, Small LES,High Flux Density White LED Emitters; 2, Eutectic-bonding, CSP packaging tecnology 3, Aluminium Nitride(AIN) Ceramic substrate, high thermal conductivity; 4, High light efficiency......
GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
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1.0*0.5mm Wafer Packaging 1005 CSP Chip LED Chip 1800-6500K For Smartwatch Automotive Interior Lighting
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...CSP packaging technology. Manufactured with flip chip technology and fluorescent film. Offers high resistance to heat, efficient heat dissipation, and minimal light decay. Features flexible arrangement and combination options within a compact luminous surface, ensuring excellent color consistency. Dimensions: Specification: Type CSP......
Demo Photoelectric Technology (Wuxi) Co., Ltd.
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Sensor IC Substrate PCB With Components 18 Layer Circuit Board Maker
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... / line spacing: 120 / 25um Surface technology: ENEPIG Plate thickness: 0.25mm Purpose: BGA IC packaging substrate Customized PCBs, also known as bespoke or tailor-made PCBs, are designed to meet specific requirements of a particular project, application,...
ONESEINE TECHNOLOGY CO.,LTD
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KOMAI Hydraulic Filter 21N-60-12210 SH 60007 SPH 9235 0759116 UA HC-5603 BT 9377 P550615 HF28894 CSP10L30 CSP-10L-30 2446U254S3 21N-60-12210 SCP-10L-30 075911603 075911603 1218075911603
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KOMAI Hydraulic Filter 21N-60-12210 SH 60007 SPH 9235 0759116 UA HC-5603 BT 9377 P550615 HF28894 CSP10L30 CSP-10L-30 2446U254S3 21N-60-12210 SCP-10L-30 075911603 075911603 1218075911603 1. PRODUCTS DESCRIPTION 1.We use imported depth type filter material,......
Guangzhou Komai Filter Co., Ltd.
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