Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System
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... with a system or sub-system in one single package. It is essential to next-generation package for fulfilling high performance and significant electrical characteristics by short interconnection paths.SiP is a substrate that enables to combine 2 or...
HongRuiXing (Hubei) Electronics Co.,Ltd.
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BT IC BGM123N256V2 Blue Gecko BT SiP Module 2dBm Wireless BT 4.2 LE Modules
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BT IC BGM123N256V2 Blue Gecko BT SiP Module 2dBm Wireless BT 4.2 LE Modules [MJD Advantage] + 15 years experience for electronic components + Secure Ordering + Excellent Feedback + Delivery Date Guaranteed + 100% Low Price Guaranteed + Export to 108 ......
ShenZhen Mingjiada Electronics Co.,Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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High-Performance Loranger Test Socket for In-line TO and SIP Packages
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...SIP Packages Modified and Custom Sockets Available May Accommodate More than One Package Fit is Independent of Package Body L, W and H Various Pitches Available Item # Item Name Package Name Number of Input/Output (I/O) Pitch 02905 041 6215 4 Input/Output (I/O) and 2.54 Millimeter (mm) Pitch Single Inline Pin (SIP) Socket SIP......
Krunter Future Tech (Dongguan) Co., Ltd.
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......
JIMA Copper
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Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof
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... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ......
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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GS600SU GS600SUA Underfill Dispensing Machine for Die Form Underfill FCBGA FCCSP SIP Packaging CUF Application
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GS600SU Underfill Dispensing Machine for Die Form Underfi ll GS600 SU is a high- speed and high- precision automatic online dispensing system which is developed based on Underfill process requirements of FCBGA/FCCSP. The system strictly controls the product......
Changzhou Mingseal Robot Technology Co., Ltd.
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SIP Package Passive Components Ideal for Industrial Applications
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Product Description: Passive IC Components are essential components used in electrical and electronic circuits, with a wide range of applications such as industrial, automotive, medical and consumer electronics. They are designed to be resistant to ......
Shenzhen Xinyuanpeng Technology Co., Ltd.
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DHT11 SIP Packaged Temperature and Humidity Sensor For Humidity Measurement And Control
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Overview : DHT11 digital temperature and humidity sensor is a calibrated digital signal output temperature and humidity Composite sensor. It uses a dedicated number Word module acquisition technology and temperature and humidity sensing technology to ......
SHENZHEN G-SUN OPTOELECTRONICS CO.,LTD
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