CMP Grinding Plate Chemical Mechanical Polishing of Wafers
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...CMP Grinding Plate Overview CMP Grinding Plate Chemical Mechanical Polishing of Wafers CMP Grinding Plates are core consumables in the Chemical Mechanical Polishing (CMP) process. They are primarily used to condition and activate the polishing pad surface, maintaining a stable polishing rate, achieving wafer......
SHANGHAI FAMOUS TRADE CO.,LTD
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Roundness Edge Grinding Sapphire Wafer Single Side Polished Surface Quality
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.... It has an orientation of ±0.5°, a wafer shape, a clear aperture of greater than 90%, and TTV of ≤3μm. It is also customizable in size to meet the needs of customers. This high-quality sapphire plate is perfect for use in a variety of applications,...
Hangzhou Freqcontrol Electronic Technology Ltd.
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0.8g/Cm3 White Aluminum Oxide Ceramics Wafer Grinding Alumina Ceramic Plate
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Plate-shaped alumina for monocrystalline silicon wafer grinding and polishing ●Specification WCA WCA-3 Al2O3 % ≥99.5 ≥99.5 Original Crystal μm 10-20 ~3.0 Density g/cm3 ≥0.8 ≥0.6 Oil Absorption % ≤65 ≤75 Shape plate Application Used for mirror finish polishing in the electronics industry, etc. Appreance White powder Application: lapping and polishing of semiconductor monocrystalline silicon wafers and crystal wafers......
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
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0.8g/Cm3 White Aluminum Oxide Ceramics Wafer Grinding Alumina Ceramic Plate
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...Wafer Grinding Alumina Ceramic Plate ● Specification WCA WCA-3 Al2O3 % ≥99.5 ≥99.5 Original Crystal μm 10-20 ~3.0 Density g/cm3 ≥0.8 ≥0.6 Oil Absorption % ≤65 ≤75 Shape plate Application Used for mirror finish polishing in the electronics industry, etc. Appreance White powder Application: lapping and polishing of semiconductor monocrystalline silicon wafers and crystal wafers......
Shaanxi KeGu New Material Technology Co., Ltd
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Stainless Steel PLC Control Copper Faucet Grinding Machine Automatic
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... Hand Grinding Polishing Machine Mirror Polishing Machine For Faucet Bodies /Door Handle / Door Plate Product Description LED sapphire Quartz wafer silicon wafer high precision horizontal thinning machine tool ceramic wafer Tungsten steel metal high......
Xiamen DingZhu Intelligent Equipment Co.,Ltd
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Micro High Precision Mould Parts Grinding SKD61 Aluminum Material
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...Grinding SKD61 Aluminum Parts Aspect Requirement: Abrasive Blasting, Polishing, sand blasting, heat treatment, painting, powder coating, Burnishing, Chemical-mechanical planarization (CMP), Electropolishing, Grinding, Industrial etching, Linishing, Tumbling, Vibratory finishing, Buffing, Shot peening, Magnetic field-assisted finishing, anodizing,electroplating, Chrome plating......
Dongguan Sheng Rui Precision Mould Co., Ltd.
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Precision Grinding And Polishing Machine HAP-100U
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...sample plate can be used for grinding and polishing 4-inch (HAP-200U: 6-inch) wafers; 3. The sample tilt angle can be adjusted; 4. The sample is gravity-pressurized, and the loading force is continuously adjustable; 5. The sample swings left and right to...
HUATEC GROUP CORPORATION
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39W Electronic Si3n4 Ceramics Substrate Plate Wafer High Temperature Insulating
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electronic supporting ceramic insulating substrate application for Ceramic substrate Application industry: Machinery, fiber optic, knife, medical, food, petroleum etc. Specific application: plunger, ceramic shaft, fiber optic bushing, stub, grinding, ......
Wuxi Special Ceramic Electrical Co.,Ltd
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Sewing Machine Aluminum Oxide Ceramic Wire Yarn Guide Good Insulation Performance
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..., carrier, insulator, fixture, clamp, chuck, nozzle, guide, frame, lining, and grinding media, milling ball or beads. These precision toleranced ceramic components or assemblies are used in a wide range of semiconductor, electronic, electrical, ......
Yixing City Kam Tai Refractories Co.,ltd
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0.38" VR Glasses LCOS OLED Display Module 720P For 3D Glasses
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...on a silicon wafer, using a semiconductor process to make a drive panel (also known as CMOS-LCD), and then grinding it on the transistor through grinding technology. It is flat and plated with aluminum as a reflector to form a CMOS substrate. Then the CMOS...
Shenzhen Anpo Intelligence Technology Co., Ltd.
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