Soft and Compressible Thermal Pad High Conductivity for Low Stress GPU Applications
|
... superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which...
Dongguan Ziitek Electronical Material and Technology Ltd.
|
Soft and Compressible Thermal Gap Pad for AD-DC Power Adapters 4.7 MHz
|
...Compressible Thermal Pad for AD-DC Power Adapters, 4.7 MHz The TIF1180N-40-10F is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. TIF100N-40-10F-Specification-sheet.pdf Features > Good thermal...
Dongguan Ziitek Electronic Materials & Technology Ltd.
|
Flexible Soft Thermal Pad Thermal Conductive Silicone Pad ISO
|
|
...Thermal Conductivity Thermal Conductive Silicon Pad For Heat Dissipation Thermal pad is also known as thermal conductive silicone gap filler, thermal gasket, soft thermal pad and other different names. Generally speaking, thermal pad is composed of silicone gel combined with thermal conductive powder to achieve different characteristics such as thermal conductivity, insulation, and compressibility. The thermal......
Shenzhen Antac Technology Limited
|
TIF100-30-50S Gray Color Thermal Pad For CPU GPU PSU
|
...Thermal Pad For CPU GPU PSU Product descriptions TlF®100-30-50S thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good thermal conductive 3.0W/mK > Moldability for complex parts > Soft and compressible......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
|
BERGQUIST GAP PAD TGP HC5000S Heat Conduction Insulation Silicone Thermal Pad
|
|
...PAD TGP HC5000S heat conduction insulation silicone pad Product features/Applications: Thermal Conductivity: 5.0 W/m-K High-compliance, low compression stress;Fiberglass reinforced for shear and tear resistance. Used in telecommunications, Integrated circuits ,digital signal processing systems, consumer electronics, hot modules to radiators,Thermal management , TIM (Thermal......
SZ PUFENG PACKING MATERIAL LIMITED
|
2 W/m.K Thin Silicone Free Thermal Pad Multipurpose For Hard Disk
|
|
...Thermal Conductivity Blue Silicone Free Thermal Pad For Hard Disk Attribute Value Test Method Composition Acrylate - Color Blue Visual Thickness(mm) 0.5-10.0 ASTM D374 Density(g/cc) 2.9 ASTM D792 Hardness(shore oo) 45±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity(W/m.K) 2.0 ASTM D5470 Application of silicon free thermal pad......
Shenzhen Aochuan Technology Co., Ltd
|
Thermal Pads Thermal Conductive Pad For New Energy Vehicle Batteries
|
... can effectively exclude air and achieve good filling and thermal conductivity effects. In addition, it also has good insulation and voltage resistance characteristics and temperature stability, safe and reliable use. thermal conductive silicone pads are...
Trumony Aluminum Limited
|
Thermal Gap Filler Thermal Conductive Material Thermal Pad 30 seconds Hardness
|
... properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal resistances. A-gapfill 600 is naturally tacky and...
Adcol Electronics (Guangzhou) Co., Ltd.
|
Filler Gap Thermal Pad Thermal Conductivity Silicone Laird Tflex HD700
|
|
... deflection characteristics. The combination will allow minimal stress oncomponents while also yielding low thermal resistance. As a result, less mechanical and thermalstresses will be experienced within your device. Tflex™ HD700PI can be provided with...
ZSUN CHIPS CO., LTD
|
Compression Thermal Abuse Case Stress 380V Battery Test Chamber
|
High Efficiency Compression Thermal Abuse Case Stress Battery Test Chamber Application: This machine can be used for module case stress at high ambient temperatures as well as thermal abuse and thermal testing. After the battery (pack) is charged, test it ......
Gester International Co., Ltd
|
