TIE380-25 One Part Thermal Conductive 1.5W/Mk Epoxy Resin Potting Compound Thermal Conductive Epoxy Glue
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...Conductive 1.5W/Mk Epoxy Resin Potting Compound Thermal Conductive Epoxy Glue Product Summary: TIE™380-25 is a one component, heat cured epoxy adhesive. It has excellent thermal conductivity and bond strength. TIE™380-25 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure. Feature > Good thermal conductivity: 2.5W/mK......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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1.5W/mK Two Component Thermal Conductive Adhesive for LED Panel Light Potting
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1.5W/mK Two Component Thermal Conductive Adhesive for LED Panel Light Potting Product Summary: TIS™680-15AB is a two-component, high thermal conductive, low temperature cured, long pot life , fire resistant Silica encapsulant glue. lt is design for ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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4.5W/MK Thermal Conductive Glue Material Conductive Epoxy Resin Potting Compound Adhesive Gel
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...MK Thermal Conductive glue Material Conductive Epoxy Resin Potting Compound adhesive Gel Low Thermal Resistance TIETM380-45 is a one component, heatcured epoxy adhesive. lt has excellentthermal conductivity and bond strength. TIETM380-45 is a good choice for highspeed production lines because it hasthe rheology to allow stencil printing anda fast, one component, heat cure. TIE380-45-TDS_EN_REV01.4.pdf Feature > Good thermal conductive......
Dongguan Ziitek Electronical Material and Technology Ltd.
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