Thermal Pad 4mm Silicone Adhesive Pads 8.5W/MK High Temperature Thermal Pad For CPU GPU PC Motherboard
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...Pad 4mm Silicone Adhesive Pads 8.5W/MK High Temperature Thermal Pad For CPU GPU PC Motherboard Ziitek TIFTM7160RUS thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features: > Good thermal conductive:8.5W/MK......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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New type ultra soft Silicone Thermal Pad 1.5W/MK Blue thermal conductive pad TIF120-05E Good thermal conductive for CPU
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New type ultra soft Silicone Thermal Pad 1.5W/MK Blue thermal conductive pad TIF120-05E Good thermal conductive for CPU Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing ......
Dongguan Ziitek Electronical Material and Technology Ltd.
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TIF700HZ Efficient Thermal Conductivity 7.5W/MK Silcione Thermal Pad Easy To Apply For CPU
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TIF700HP Efficient Thermal Conductivity 7.5W/MK Silcione Thermal Pad Easy To Apply For CPU Product descriptions TlF700HP is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low ......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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3W/MK Soft Silicone Thermal Pad Insulating Sheet for Computer CPU GPU Chip Heat Sink Heatsink Cooling Thermal Conductive Pad
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Product Description: Our Thermal Conductive Silicone Pad is made of silicone, a durable material that can withstand high temperatures and harsh environmental conditions. With a hardness of 45 ShoreC and a tensile strength of 3 MPa, this Thermal Heat Sink ......
Shenzhen Linmao Electronic Material Co.,Ltd.
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TIM Thermal Interface Materials Electronics Thermal Phase Change Material ROHS
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.... With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to enhance the cooling of the most rigorous thermal challenges in electronics. Softening between 50°C – 70°C, the initial pad thickness can decrease to a bondline as thin as 35µm...
ZSUN CHIPS CO., LTD
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