JEDEC Standard JEDEC IC Tray Anti-Static For CQFP48 Package Chips
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...,Sales of IC packaging and testing as well as semiconductive wafer fabrication process in automated handling,carrying,transportation to provide customers turnkey services. Customized cases : 5G Core Part, Socket, RF Chip, MEMS, Optical Chip Compatibility:...
Shenzhen Hiner Technology Co., Ltd.
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99.9% High Accuracy X Ray Chip Counter For Quad Reel / JEDEC Tray / Tube Package
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...Chip Counter for quad reel, JEDEC tray , Tube package Main Configuration of Chip Counter 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package......
Unicomp Technology
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Non-isolated PoL module DC converters IC Chips within Tray Package
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...Chips product in our inventory belongs to the category of Integrated Circuits IC, which are essential components in electronic devices. These IC Chips are housed in a tray package/case, making them convenient for handling and storage. When it comes to voltage breakdown specifications, these IC Chips......
ZSUN CHIPS CO., LTD
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YT20 SMT pick and place machine apply to 0201~40*40mm tape reel package and IC tray feeder
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Machine main features Adopt High speed multi modular head, apply to ultra small chip 0201~40*40 mm large chip, wide component range; Vacuum sensing device: Each placement head with independent detection function, which improves the stability of the ......
Shenzhen Eton Automation Equipment Co., Ltd.
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French fries potato chips plastic tray packaging making machine
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Product Description Cutting Frequency 15-45 times/min Stroke adjustable range 50-180mm Max.Forming Depth 30-45mm Pressure 0.4-0.7mpa Overall dimensions 2500*1000*1700mm Motor power >=4kw Weight 1000kgs Main Features 1. The plastic food tray machine is ......
Ruian Hualida Machinery Co., Ltd.
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ATF1504AS-10JU44 Programmable IC Chip - High Speed 4K Gate Capacity Low Power Consumption
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... Power Consumption • Enhanced Testability • 4-Level Programmable Outputs • 5V or 3.3V Supply Voltage • Up to 1.5 Million Gates • Fully Compatible with JEDEC Standard Device •...
Shenzhen Sai Collie Technology Co., Ltd.
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IC Chip THGBMJG6C1LBAU7 64Gbit eMMC Memory IC 153-WFBGA Surface Mount
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... Of THGBMJG6C1LBAU7 Part Number THGBMJG6C1LBAU7 Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 153-WFBGA Features Of THGBMJG6C1LBAU7 Higher interface speed HS400 in accordance with JEDEC 5.1 Managed memory Other...
ShenZhen Mingjiada Electronics Co.,Ltd.
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Durostone Material SMT Matrix Trays with Custom Pocket Dimensions
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...Trays With Custom Pocket Dimensions CWSC-5 Benefits 1. Machined with custom pocket dimensions for safe handling and package protection 2. Allows Surface Mount components to be picked up in a repeatable fashion when tape and reel is not an option 3. Provides pick and place SMT package presentation solution for components for which no standard JEDEC tray......
Shenzhen SMTfly Electronic Equipment Manufactory Ltd
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MTFC4GLWDM-4M 2.7V-3.6V eMMc 4GB 70MB/s read speed 7.5MB/s write speed memory chip
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...chip MTFC4GLWDM-4M MTFC4GLWDM-4M AAT Z, MTFC4GLWDM-4M AAT A Features • MultiMediaCard (MMC) controller and NAND Flash •Packages (RoHS compliant, "green package") – 153-ball TFBGA • VCC: 2.7–3.6V • VCCQ (dual voltage): 1.65–1.95V; 2.7–3.6V • Temperature ranges – Operating temperature:–40˚C to +105˚C – Storage temperature: –40˚C to +105˚C MMC-Specific Features • JEDEC......
Shenzhen Retechip Electronics Co., Ltd
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Non Toxic Blister Pack Packaging Blister Electronic Components Chip Tray
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Non Toxic Blister Pack Packaging Blister Electronic Components Chip Tray Product Details Electronic components plastic inner tray PET/PVC blister Tray- electronic chip tray Our IC card tray is made fromhigh quality plastic material which has gained the ......
Shenzhen Delixin Co.,Ltd
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