DDR IC Package Substrate Pcb
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...:DDR substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished ......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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...IC Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......
JIMA Copper
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof
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... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ......
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
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K4B4G1646E-BYMA Samsung DDR SDRAM Package FBGA-96 ROHS
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DDR SDRAM K4B4G1646E-BYMA K4B4G1646E-BYMA Manufacturer Samsung MFR.Part #K4B4G1646E-BYMA JLCPCB Part #C500275 PackageFBGA-96 DescriptionFBGA-96 DDR SDRAM ROHS Datasheet Download SourceJLCPCB Assembly Type SMT Assembly CAD ModelPCB Footprint or Symbol ......
ShenZhen QingFengYuan Technology Co.,Ltd.
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ESD Plastic JEDEC Standard Matrix Tray For IC Packaging
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... is the packaging tray used by the enterprise for its chip packaging test. Because the IC chip is small and thin, the enterprise will generally take external protection to avoid scratches and damage. JEDEC Matrix Tray, which is a satisfactory storage of...
Shenzhen Hiner Technology Co.,LTD
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ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP63
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ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP Product Status Active Function Step-Up Output Configuration Positive Topology Boost, SEPIC Output Type ......
Shenzhen Sai Collie Technology Co., Ltd.
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Custom Silver Bonding Wire With Composite Material Treatment For IC Packaging
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...game - changer in the field of high - reliability IC packaging. Made of high - purity silver, this bonding wire offers excellent electrical conductivity, ensuring efficient signal transmission in ICs. The composite material treatment further enhances its...
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
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IC Packaging Parts Inline Cleaning System With Trial Chemical Wash Sections
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...a IC packaging parts auto cleaning system with trial chemical wash sections. SC830 is a high wash ability FC packaging deflux cleaning system. 810 IC packaging auto cleaing machine is used to clean flux residuals, soder balls and particles on FC package ......
Dongguan Shenhua Mechanical and Electrical Equipment ...
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