DDR IC Package Substrate Pcb
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...:DDR substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished ......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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1oz Copper Weight Package Substrate PCB IC PCB Board Rohs Approval BT board
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Ceramic IC Substrate PCBs ROHS Compliant 1oz Copper Weight 2 Weeks Lead Time *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, ......
LT CIRCUIT CO.,LTD.
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1oz Copper Weight Package Substrate PCB IC PCB Board Rohs Approval BT board
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Ceramic IC Substrate PCBs ROHS Compliant 1oz Copper Weight 2 Weeks Lead Time *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, ......
LT CIRCUIT CO.,LTD.
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof
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... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ......
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
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ESD Plastic JEDEC Standard Matrix Tray For IC Packaging
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... is the packaging tray used by the enterprise for its chip packaging test. Because the IC chip is small and thin, the enterprise will generally take external protection to avoid scratches and damage. JEDEC Matrix Tray, which is a satisfactory storage of...
Shenzhen Hiner Technology Co., Ltd.
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ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP63
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ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP Product Status Active Function Step-Up Output Configuration Positive Topology Boost, SEPIC Output Type ......
Shenzhen Sai Collie Technology Co., Ltd.
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Precision Etched Lead Frames for Semiconductor IC Packaging Custom Metal Parts
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...IC Packaging Custom Metal Parts Lead Frames Overview We specialize in manufacturing high-precision lead frames using advanced metal etching technology. Our lead frames are essential components in semiconductor packaging, providing reliable electrical connectivity and heat dissipation for integrated circuits (ICs). Custom Precision Etched Lead Frames for Semiconductor Packaging......
Shenzhen Xinhaisen Technology Limited
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IC Packaging Parts Inline Cleaning System With Trial Chemical Wash Sections
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...a IC packaging parts auto cleaning system with trial chemical wash sections. SC830 is a high wash ability FC packaging deflux cleaning system. 810 IC packaging auto cleaing machine is used to clean flux residuals, soder balls and particles on FC package ......
Dongguan Shenhua Mechanical and Electrical Equipment ...
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