Multilayer Rigid IC Substrate PCB Board Fingerprint Card Soft Gold Hard Gold
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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0.15mm IC assembly package substrate For semiconductor package
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...IC card,BANK card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate...
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Custom IC Substrate PCB , Printed Circuit Board Assembly 0.15mm Plate Thickness 2 layers of COF PI reinforcement, minimu
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2 layers of COF Panasonic material PIGL042504-250MH, CU9/1um,plate thickness,IC Package Substrate 2 layers of COF PI reinforcement, minimum hole 0.05mm, Product Description Product area: industrial liquid crystal driver ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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MT48LC4M16A2TG Synchronous Dram IC MICRON TSOP4 Meg X 4 X 4 Banks
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MT48LC4M16A2TG Synchronous Dram MICRON Original Package TSOP Tray MT48LC16M4A2 – 4 Meg x 4 x 4 banks GENERAL DESCRIPTION The Micron® 64Mb SDRAM is a high-speed CMOS, dynamic random-access memory containing 67,108,864 bits. It is internally configured as a ......
DELI ELECTRONICS TECHNOLOGY CO.,LTD
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MT48LC4M16A2TG-75 IT:G TR Synchronous Dram IC MICRON TSOP4 Meg X 4 X 4 Banks
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MT48LC4M16A2TG Synchronous Dram MICRON Original Package TSOP Tray MT48LC16M4A2 – 4 Meg x 4 x 4 banks GENERAL DESCRIPTION The Micron® 64Mb SDRAM is a high-speed CMOS, dynamic random-access memory containing 67,108,864 bits. It is internally configured as a ......
ChongMing Group (HK) Int'l Co., Ltd
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DRAM IC ESD Component Tray For Electronics Parts Packing
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DRAM IC ESD Component Tray For Electronics Parts Packing Enhance automation and protection with JEDEC trays designed around your product, not the other way around. Features: 1. Designs conform to the JEDEC international standard and have strong versatility. 2. Optimal product design can provide a variety of packaging ICs......
Shenzhen Hiner Technology Co., Ltd.
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OEM Thin FR4 pcb used for IC Substrate Prototype PCB Fabrication Two Layer PCB Board
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... used for IC Substrate Prototype PCB Fabrication Two Layer PCB Board When you're looking for prototype PCB fabrication, it's important to work with PCB service providers who can quickly turn around your PCB design resources. These sample boards help you ......
Shenzhen Meidear Co., Limited
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MT47H64M16HR-3 IT:H 1GBIT Dram IC 84FBGA Parallel Integrated Circuits
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MT47H64M16HR-3 IT:H IC DRAM 1GBIT PARALLEL 84FBGA Category Integrated Circuits (ICs) Memory Memory Mfr Micron Technology Inc. Series - Package Tray Product Status Obsolete Memory Type Volatile Memory Format DRAM Technology SDRAM - DDR2 Memory Size 1Gbit ......
J&T ELECTRONICS LTD
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Electronics Inc SMD ICs Amplifier Circuit Board Sap Bom Report
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... board. Good packaging also protects the device from damage.There are numerous packaging types, some of which have standardized dimensions and tolerances.These are also registered with some associations of trade industry like JEDES and Pro Electron.On the...
Chengdu Cesgate Technology Co., Ltd
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4 Core 64 Bit 1.3GHz ARM Cortex Microprocessor IC BGA Package MIMX8MQ6CVAHZAA
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...® Cortex®-A53 core, which operates at speeds of up to 1.3 GHz. A general purpose Cortex®-M4 core processor is for low-power processing. The DRAM controller supports 32-bit/16-bit LPDDR4, DDR4, and DDR3L memory.There are a number of other interfaces for...
ShenZhen Mingjiada Electronics Co.,Ltd.
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