semiconductor packaging Substrate of DRAM Memory manufacture
|
...Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.15mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4......
HongRuiXing (Hubei) Electronics Co.,Ltd.
|
Memory IC Chip MT62F1G64D8WT-031 LPDDR5 DRAM Memory IC 6.4Gbps FBGA Package
|
Memory IC Chip MT62F1G64D8WT-031 LPDDR5 DRAM Memory IC 6.4Gbps FBGA Package Product Description Of MT62F1G64D8WT-031 MT62F1G64D8WT-031 - LPDDR5 DRAM Memory IC for Mobile Devices and Artificial Intelligence (AI) are designed to meet the demands of 5G networks. The DRAM......
ShenZhen Mingjiada Electronics Co.,Ltd.
|
Industrial DRAM Memory Chip DDR3l DDR3L X16 2Gb F60C1A0002-M69W
|
Dynamic Random Access Memory DRAM IndustrialDDR3l DDR3Lx16 2Gb F60C1A0002-M69W Device Features Density: 2G bits Organization 128Meg x 16 bits Package 96-ball FBGA Lead-free (RoHS compliant) and Halogen-free Power supply VDDNDDQ =1.35V(1.283 to 1.45V) ......
Shenzhen Filetti Technology Co., LTD
|
256mbit 54 Pin EEPROM Memory HY57V561620FTP-HI Dram Memory Chip SDRAM 16Mx16 3.3V TSOP-II
|
HY57V561620FTP-HI DRAM Chip SDRAM 256Mbit 16Mx16 3.3V 54-Pin TSOP-II Shipping: 1, We can shipping all over the world by DHL, UPS, FEdex, TNT . The packaging is very safe and strong. Please nitfy me you have any special needs 2, It will take around 3-5 days......
J&T ELECTRONICS LTD
|
MT44K16M36RB-107E:B TR IC DRAM 576MBIT PAR 168BGA Micron Technology Inc.
|
...Product Category Resonators Mfr Micron Technology Inc． Series - Package Tape & Reel (TR) Product-Status Active Memory-Type Volatile Memory-Format DRAM Technology DRAM Memory-Size 576Mb (16M x 36) Memory-Interface Parallel Clock-Frequency 933 MHz Write-......
Sanhuang electronics (Hong Kong) Co., Limited
|
6 Layer Copper Substrate PCB Through Hole FR4 TG150 HDI High Frequency
|
...Substrate PCB,gold finger Product Description Computer memory 6-layer through hole, FR-4, TG150, Plate thickness 1.60mm, copper thickness 1OZ, Green solder resist, impedance, immersion gold 1u" + gold finger, Minimum line width 3/3mil Quantities range from prototype to volume production. 100% E-Test Packaging: Vacuum Packaging......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
|
DRAM FBGA 78 Memory ICs DDR3L Ic Memory Chip AS4C256M8D3LC 12BIN
|
... ball FBGA PACKAGE New part electronic components: Model Package Date STM32F407ZET6 LQFP144 2020+/2019+ ADM2587EBRWZ-REEL7 SOP-20 2020+ LAN8720A-CP-TR QFN24 2020+ ......
LU'S TECHNOLOGY CO., Ltd.
|
DRAM FBGA 78 Memory ICs DDR3L Ic Memory Chip AS4C256M8D3LC 12BIN
|
... ball FBGA PACKAGE New part electronic components: Model Package Date STM32F407ZET6 LQFP144 2020+/2019+ ADM2587EBRWZ-REEL7 SOP-20 2020+ LAN8720A-CP-TR QFN24 2020+ ......
ChongMing Group (HK) Int'l Co., Ltd
|
IS42S16400J-7TL Memory IC Chip
|
...Memory Format DRAM Memory Type Volatile Memory Size 64Mb (4M x 16) Speed 143MHz Interface Parallel Voltage - Supply 3 V ~ 3.6 V Operating Temperature 0°C ~ 70°C (TA) Package / Case 54-TSOP (0.400", 10.16mm Width) Supplier Device Package 54-TSOP II Shipment UPS/EMS/DHL/FedEx Express. Condtion New original factory. IS42S16400J-7TL Packaging......
KZ TECHNOLOGY (HONGKONG) LIMITED
|
DRAM Dynamic Random Access Memory 32G MT53D1024M32D4DT-053 AIT:D
|
... Memory Type: SDRAM Mobile - LPDDR4 Installation style: SMD/SMT Package / Box: VFBGA-200 Data bus width: 32 bit Tissue: 1G x 32 Storage capacity: 32 Gbit ......
Eastern Stor International Ltd.
|