EM370 Material Hdi Pcb Board 0.95mm Layers Finer Track Structures
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0.95mm Anylayer HDI / 12Layer mainboard / EM370D CCL / UFS and OSC area OSP treatment Definitions and standards for HDI • IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules (8/95) • IPC-2226 ......
Topmatch Electronics (Suzhou) Co., Limited.
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Blind Buried Holes FR4 EM370 8 Layer HDI PCB Board
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8 Layer Printed Circuit Board With Blind And Buried Holes PCB Specifications: Layer Type: HDI PCB Layer Count: 8 Layer Board Thickness: 1.6MM Material: FR4 EM370 EM-370(D) Datasheet 20171121_18061416999.pdf Min Hole: 0.1MM Min Line: 4/ Mil BGA Size: 11Mil ......
Witgain Technology Ltd
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10 Layer 1.6 MM HDI PCB Thickness FR4 TG 170 Material
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HDI PCB 10 Layer 1.6 MM Thickness FR4 TG 170 Material PCB Specifications: 1 Part NO: HDIPCB0014 2 Layer Count: 10 Layer HDI PCB 3 Finished Board Thickness: 1.6MM 4 3+N+3 Drilling: L1-L2 0.1MM, L2-L3 0.1MM, L1-L3 0.1MM, L3-L8 0.1MM, L8-L9 0.1MM, L9-L10 0.1MM, L8-L10 0.1MM, L1-L100.2MM 5 Min Lind Space&Width: 2.0/2.4mil 6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1 7 Application Area: Industrial Control 8 PCB Size: 100mm*95mm......
Witgain Technology Limited
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