FCCSP package substrate 4L Buildup types ENEPIG
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Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof
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... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ......
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......
JIMA Copper
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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CUF FCBGA Advanced Packaging Equipment Underfill Dispensing Solution FCCSP SiP
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... CUF (Capillary Underfill) dispensing tasks in advanced semiconductor packaging, including FCBGA, FCCSP, and SiP modules. The GS600 series combines a piezoelectric jetting valve with six integrated process modules, which ensures steady flow ......
Changzhou Mingseal Robot Technology Co., Ltd.
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IC Integrated Circuits AM2432BSEFHIALXR FCCSP-293 Microcontrollers - MCU
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... Circuits AM2432BSEFHIALXR FCCSP-293 Microcontrollers - MCU Specifications Product Attribute Attribute Value Manufacturer: Texas Instruments Product Category: ARM Microcontrollers - MCU Series: AM2432 Mounting Style: SMD/SMT Package / Case: FCCSP-293 Core......
Shenzhen Zhongkaixin Micro Electronics Co., Ltd.
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AM6252ATCGHAALW MPU HMI SoC With Arm Cortex-A53-Based Edge AI And Full-HD Dual Display FCCSP-425
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... Cortex M4F Number of cores: 2 Core Data bus width: 64 bit Maximum clock frequency: 400 MHz Package/Case: FCCSP-425 Series: AM625 Installation style: SMD/SMT Minimum operating temperature: - 40 C Maximum operating temperature: +105 C...
Eastern Stor International Ltd.
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TX08DACP Wireless Communication Module 8-Channel Ultrasound Transmitter FCCSP-196 Package
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TX08DACP Wireless Communication Module 8-Channel Ultrasound Transmitter FCCSP-196 Package [MJD Advantage] + 15 years experience for electronic components + Secure Ordering + Excellent Feedback + Delivery Date Guaranteed + 100% ......
ShenZhen Mingjiada Electronics Co.,Ltd.
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TMS320C6203BGNY300 FCCSP-384 NEW ORIGINAL IC CHIP
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TMS320C6203BGNY300 FCCSP-384 Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized switching performance Product Technical ......
Shenzhen Tengshengda ELECTRIC CO., LTD.
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