eMMC IC Package Substrate PCB
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...IC package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC substrate,IC assembly,Storage IC......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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...IC Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......
JIMA Copper
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THGBMNG5D1LBAIL Memory IC Chip 4 GB eMMC Memory IC FBGA-153 Package
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...IC Chip 4 GB eMMC Memory IC FBGA-153 Package Product Description Of THGBMNG5D1LBAIL THGBMNG5D1LBAIL is 4 GB eMMC Memory IC,the package is FBGA-153. Specifications Of THGBMNG5D1LBAIL Package/Case: FBGA-153 Memory Size: 4 GB Minimum Operating Temperature: - 25 C Maximum Operating Temperature: + 85 C Moisture Sensitive: Yes Unit Weight: 5 g Other Electronic Components In Stock Part Number Package......
ShenZhen Mingjiada Electronics Co.,Ltd.
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NOR Flash Memory IC 1G 110ns S29GL01GS11DHIV20 FBGA-64 Package
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S29GL01GS11DHIV20 Infineon 1G 3V 110ns Parallel NOR Flash FBGA-64 Manufacturer: Infineon Product Type: NOR Flash Installation style: SMD/SMT Package / Box: FBGA-64 Series: S29GL01G/512/256/128S Storage capacity: 1 Gbit Supply Voltage - Min: 2.7 V Supply ......
Eastern Stor International Ltd.
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Customized JEDEC Matrix Trays Loading FBGA IC ESD Rohs Raw Material
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Customized JEDEC Matrix Trays Loading FBGA IC ESD Rohs Raw Material Protect your ICs from electrostatic discharge and mechanical stress with JEDEC-compatible trays built for cleanroom and factory use. Hiner-pack offers the ultimate ......
Shenzhen Hiner Technology Co., Ltd.
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof
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... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ......
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
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ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP63
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ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP Product Status Active Function Step-Up Output Configuration Positive Topology Boost, SEPIC Output Type ......
Shenzhen Sai Collie Technology Co., Ltd.
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Custom Silver Bonding Wire With Composite Material Treatment For IC Packaging
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...game - changer in the field of high - reliability IC packaging. Made of high - purity silver, this bonding wire offers excellent electrical conductivity, ensuring efficient signal transmission in ICs. The composite material treatment further enhances its...
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
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