SiC Ceramic Vacuum Chuck Flip-Chip Bonding Mirror Polishing High-Stiffness
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...Flip-Chip Bonding processes in semiconductor manufacturing. Its core function is to stably adsorb and secure wafers or dies during bonding, ensuring micrometer or even sub-micrometer-level alignment and interconnection...
SHANGHAI FAMOUS TRADE CO.,LTD
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Ultra-Thin 0.07mm RFID Inlay with 10 Years Data Storage and Flip Chip Bonding for High Performance
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... Dia 21mm Wet Inlay Size Dia 25mm Chip RFID Memory 144/504/888bytes Antenna Aluminium etching antenna Bonding Flip chip Unwinding chip side up Thickness 0.07mm Reading Distance 1.5~3cm (depends on reader applied) Operation Temp. -20°C~+65°C Storage Temp. -......
White Smart Co., Limited
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Direct Bond Copper DBC Ceramic Substrate , Aluminum Nitride Substrate
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Direct Bond Copper Alumina Metallized Ceramic DBC Substrate For Power Electronics Why choose us? 1. Support custom made metalized ceramic substrates, whatever, it's prototyping project, or cost down. 2. With over 15 years of OEM, ODM manufacturing ......
Jinghui Industry Limited
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Heat Sink Cooling Zirconia Ceramic Substrate Chip Zirconia Ceramic Blade
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... heating tube, refractory material, and heating element. Zirconia ceramics have sensitive electrical performance parameters and are mainly used in oxygen sensors, solid oxide fuel cells (SOFC) and high temperature ......
Wuxi Special Ceramic Electrical Co.,Ltd
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RGBW Led Light Module High Power 250W Cree Flip-chip LED Emitters
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... 2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity between LEDs and MCPCB substrate 3, Unique Parallel and Serial connection of LED design, Lower Forward Current result in Lower heat-emission to...
GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
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Flip chip 120W high efficiency led cob chips white color BICOLOR-STARRY super aluminum substrate
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Flip chip 120W high efficiency led cob chips white color BICOLOR-STARRY super aluminum substrate Product Specifications Models LN-AFS40PWW-PS120-29 Power 120W Color temperature WW: Warm white=2800-3200K NW: Neutral white=4000-4500K PW: Pure white=5000-6000K Luminous efficiency 110-130lm/w Working voltage 35-38V Circuit 12S20P*2 Size 40*40mm LES(Diameter) R29MM/R18MM View angle 120DEG CRI >80 SUBSTRATE......
Shenzhen Learnew Optoelectronics Technology Co., Ltd.
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BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
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...Applicable up to 35µm pitch for flip-chip assembly (peripheral) Thin build-up laminate for SiP applications (0.3mmt for 1-2-1) Applicable environmentally-friendly products (Halogen-free, Lead-free) ......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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ASM NANO PCB SMT Machine Die Bonder And Flip Chip Bonder Machine
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...Flip Chip Bonder Machine ASM NANO Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder Machine Infinite Automation is the best choice if you are looking for dependable Factory Automation Machines and Production Equipment. Among Our offered machines are original and pre-owned Die Bonding and Die Attach, Wire Bonding, Die Bonder and Flip Chip......
INFINITE AUTOMATION CO ., LIMITED
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Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine
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... Features 1. Utilizes a sheet-to-sheet docking station with dual swing arms for 180° cross-bonding. 2. Compatible with a printer to enable a variety of in-line process solutions. 3. Fully integrated carrier from loading, printing, to die bonding and...
Shenzhen Hongxinteng Technology Co., Ltd.
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Advanced Vacuum Brazing Furnace for AMB Bonding of Ceramic Substrates at 1200C
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Vacuum brazing furnace for AMB bonding of ceramic substrates This equipment is used for AMB copper cladding process of Si3N4 and Aln substrates.It can also be applied to vacuum and high temperature degassing sintering of high density alloys, tungsten-......
Zhuzhou Ruideer Metallurgy Equipment Manufacturing Co.,Ltd
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