FR4 IT180 94V0 RoHS 2-4u" ENIG Multi Layer PCB HDI Printed Circuit Board
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FR4 IT180 94V0 RoHS 2-4u" ENIG Multi Layer PCB HDI Printed Circuit Board Abis Circuits Co., Ltd is a professional PCB manufacturer which was established on Oct, 2006 and focus on double side, Multilayer and HDI pcb mass production. We have two factories together , the factory in Shenzhen is specialized in small and middle volume orders and the factory in Huizhou is for big volume and HDI. Product Details: What is a HDI PCB......
Abis Circuits Co., Ltd.
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1.6mm FR4 ENIG 6 Layer PCB Circuit Board Green Solder Mask Immersion Gold
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... Press-fit Hole quick Turn PCB Founded in 2010, Shenzhen Huashengxin Circuit is a professional manufacturer for printed circuit boards. Huashengxin products cover 1~32L FR-4 PCB, IMS PCB,HDI Boards, high frequency PTFE boards and Rigid-flex boards etc. We...
Huashengxin Circuit Limited
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1.2 mm FR4 DIP Multi Layer PCB Assembly HASL and Gold Finger with Green Solder Mask
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...FR4 DIP Multi Layer PCB Assembly HASL and Gold Finger with Green Solder Mask Quick Details: 1. Professional PCB manufacturer. 2. PCBA,OEM,ODM service are provided. 3. Gerber file needed. 4. Products are 100% E-tested. 5. Quality guarantee and professional after-sale service. PRODUCT’S DETAILS Raw Material FR-4 (Tg 180 available) Layer Count 4-Layer......
Shenzhen Zhong Yi Xin Circuit Co,. ltd.
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Rogers 3006 Stack Up FR4 4 Multi Layered Pcb Multilayer Pcb Manufacturing
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Rogers 3006 Stack Up FR4 4 Layer Multilayer PCB Printed Circuit Board Fabrication Quick detail: Origin:China Special: 2 raw material mix compression Layer:4 Thickness:1.2mm Surface: ENIG Hole:0.8 Specification: RO4350B™ materials are proprietary woven ......
Shenzhen Xinchenger Electronic Co.,Ltd
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ENIG Gold Finger FR4 TG150 8 Layer PCB Matte Black Solder Mask Color
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ENIG Gold Finger FR4 TG150 8 Layer PCB Matte Black Solder Mask Color ENIG 8 Layer Printed Circuit Board Gold Finger PCB PCB Specifications: Part NO: S08E5551A0 Layers: 8Layer Surface Finished: Immersion gold + Gold Finger Material: FR4 Thickness: 0.9mm PCB......
Witgain Technology Limited
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FR4 TG135 2 Layer PCB , ENIG 2u Surface 0.075mm PCB SMT Assembly
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FR4 TG135 2-layer PCB ENIG 2u surface 0.075mm FR4 TG135 is a substrate material used in the manufacture of printed circuit boards (PCBs). Its glass transition temperature (Tg) of 135°C indicates that it can withstand moderate temperatures during operation without losing its mechanical or electrical properties. A 2-layer PCB made with FR4 TG135 material refers to a PCB with two layers of substrate material and copper traces. ENIG......
ShenZhen Jieteng Circuit Co., Ltd.
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High Frequency Multi Layer PCB Board Manufacturer Fabrication
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...Multi layer PCB board Manufacturer Fabrication Basic information: Name: Multi layer pcb printed circuit boards Material:Rogers 3003+fr4 Layer: 6 Thickness:1.0mm Surface finish: ENIG Copper weight:1OZ Application:communication Min line and width:4mil ONESEINE Multi layer pcb fabrication: Cut raw material Inner layer......
ONESEINE TECHNOLOGY CO.,LTD
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Impedance Control Multi Layer PCB Board Hight TG Electric Products Main Board
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... Surface finishing: HASL-LF/ ENIG/ OSP/immersion silver/ immersion Tin/ Nickel plated/ carbon ink print Via: Blind via/ Buried via Certificates:UL/ ISO ......
Shenzhen Senyan Circuit Co., Ltd.
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Mulitiple Layers FR4 ENIG 1u' HDI PCB Prototype
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FR4 ENIG 1u' HDI Pcb Prototype ,Electronic Printed Circuit Board With Mulitiple Layers Features Of HDI Print Circuit Board 1. One Stop OEM Service: Made in Shenzhen of China 2. Manufactured by Gerber File and Bom LIst Offered by Customers 3. SMT, DIP Technology Support 4. FR4 Material Meet 94v0 Standard 5. UL,CE,ROHS Compliant 6. Standard Lead Time: 4-5days for 2L;5-7 for 4L. Expedited Service is available Files Requested For PCB......
Shenzhen Shinelink Technology Ltd
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FR4 ENIG Double Side PCB Assembly , 3OZ Customized PCB Assembly
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...FR4 ENIG Double Side PCB Assembly for Control Series Products Double Side PCB Assembly Introduction Double-sided PCB Assembly are mainly used for electronic computers with high electronic communication equipment requirements, advanced instruments, and performance. It is usually punched in the middle of the circuit board to connect the double-sided PCB board. PCB CAPABILITIES No. Items 1 HDI Capabilities HDI ELIC(5+2+5) 2 Max layer......
Beijing Haina Lean Technology Co., Ltd
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