Wholesale Heat Conductivity 0.5mm-5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad For Laptop Led CPU GPU
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Wholesale Heat Conductivity 0.5mm-5mm Thermal Conductive Pad Gap Filling Materials Cooling Pad for Laptop Led CPU GPU Company Profile With professional R&D capabilities and over 18 year experiences in thermal interface material industry, Ziitek company......
Dongguan Ziitek Electronical Material and Technology Ltd.
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TIF700PUS Custom 7.5W/Mk 3Mm 2Mm 1.5Mm Silicone Conductive Soft Gpu Cpu Thermal Pad
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TIF700PUS Custom 7.5W/Mk 3Mm 2Mm 1.5Mm Silicone Conductive Soft Gpu Cpu Thermal Pad Product descriptions TIF®700PUS Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
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Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Multiscene CPU Thermal Pad Material Weather Resistant Pink Color
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...Thermal Conductivity Pink Thermal Pad Silicone Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ＞6.0 ASTM D149 Dielectric Constant(@10mhz) 7.2 ASTM D150 Volume Resistivity(Ω.cm) 1012 ASTM D257 Flammability V-0 UL94 Thermal...
Shenzhen Aochuan Technology Co., Ltd
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High Volume Resistivity Custom CPU Thermal Pad with Options Density 3.0±0.5 G/cm3
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Product Description: With an operating temperature range of -40°C to 200°C, this Silicone Thermal Pad can easily handle extreme temperatures, making it a perfect choice for use in high-temperature applications. Its continuous use temperature range of -40......
Shenzhen Antac Technology Limited
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Coated Paper Hang Tab Box Packaging For Silicone CPU Thermal Pads SIM CARD
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Shenzhen Senwi Printing & Packaging Co., Ltd.
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Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad
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... thermal conductive material for soft gap filling. Product Features : Highly conformal. High thermal conductivity. Low modulus. Non-fiberglass options for applications requiring further stress reduction. Glass fiber reinforced to improve workability and...
SZ PUFENG PACKING MATERIAL LIMITED
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Best Quality High Thermal Conductivity GPU CPU Thermal Gap Pads
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...Thermal Conductivity GPU CPU Thermal Gap Pads Thermal pads are a type of thermal interface material (TIM) that are used to improve the heat transfer between a heat source and a heat sink. They are typically made of a flexible material such as silicone, which can be easily cut or trimmed to fit a wide range of applications. Thermal pads serve the same purpose as every other form of thermal......
Trumony Aluminum Limited
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Thermal Gap Filler Thermal Conductive Material Thermal Pad 30 seconds Hardness
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... properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal resistances. A-gapfill 600 is naturally tacky and...
Adcol Electronics (Guangzhou) Co., Ltd.
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Filler Gap Thermal Pad Thermal Conductivity Silicone Laird Tflex HD700
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... deflection characteristics. The combination will allow minimal stress oncomponents while also yielding low thermal resistance. As a result, less mechanical and thermalstresses will be experienced within your device. Tflex™ HD700PI can be provided with...
ZSUN CHIPS CO., LTD
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